Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
First Claim
1. A method of forming a precursor for use in manufacturing microelectronic, optoelectronic, photonic, or microelectromechanical system devices, said method comprising the steps of:
- providing a quantity of monomers and a substrate having a surface onto which a coating layer is to be applied, said monomers having the formula wherein;
each R is individually selected from the group consisting of alkyl groups;
each X is individually selected from the group consisting of cyano groups, nitroso groups, and the halogens;
m is 0-10; and
n is 1-12;
forming said monomers into a plasma; and
depositing said plasma monomers on said substrate surface so as to form the coating layer thereon.
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Accused Products
Abstract
An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 μm or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical
37 Citations
73 Claims
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1. A method of forming a precursor for use in manufacturing microelectronic, optoelectronic, photonic, or microelectromechanical system devices, said method comprising the steps of:
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providing a quantity of monomers and a substrate having a surface onto which a coating layer is to be applied, said monomers having the formula wherein;
each R is individually selected from the group consisting of alkyl groups;
each X is individually selected from the group consisting of cyano groups, nitroso groups, and the halogens;
m is 0-10; and
n is 1-12;
forming said monomers into a plasma; and
depositing said plasma monomers on said substrate surface so as to form the coating layer thereon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A precursor structure formed during the process of manufacturing microelectronic, optoelectronic, photonic, or microelectromechanical system devices, said structure comprising:
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a substrate having a surface; and
a coating layer on said surface, said coating layer being formed by the steps of;
providing a quantity of monomers having the formula wherein;
each R is individually selected from the group consisting of alkyl groups;
each X is individually selected from the group consisting of cyano groups, nitroso groups, and the halogens;
m is 0-10; and
n is 1-12;
forming said monomers into a plasma; and
depositing said plasma monomers on said substrate surface so as to form the coating layer thereon. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A method of forming a precursor for use in manufacturing integrated circuits comprising the steps of:
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providing a quantity of monomers and a substrate having a surface onto which an antireflective coating is to be applied;
forming said monomers into a plasma;
depositing said plasma monomers on said substrate surface so as to form an antireflective coating layer; and
applying a photoresist layer to said antireflective coating layer to yield the circuit precursor. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59)
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60. A precursor structure formed during the course of the integrated circuit manufacturing process, said structure comprising:
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a substrate having a surface;
an antireflective coating layer on said surface, said antireflective coating layer being formed on said surface by a plasma enhanced chemical vapor deposition process; and
a photoresist layer on said antireflective coating layer. - View Dependent Claims (61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73)
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Specification