Wafer handler
First Claim
Patent Images
1. An apparatus for manually transporting a semiconductor wafer, comprising:
- a handle; and
a grip portion at an end of the handle, the grip portion adapted to extend along a peripheral edge of the wafer and having an upper surface for supporting the wafer, the upper surface having a plurality of vacuum ports therein.
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Accused Products
Abstract
Manually operated wafer handlers are provided for handling and transporting semiconductor wafers. The wafer handlers contact the wafers only at the outer edges of the wafers, thereby preventing damage to the interior surfaces of the wafers on which integrated circuits are formed.
31 Citations
33 Claims
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1. An apparatus for manually transporting a semiconductor wafer, comprising:
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a handle; and
a grip portion at an end of the handle, the grip portion adapted to extend along a peripheral edge of the wafer and having an upper surface for supporting the wafer, the upper surface having a plurality of vacuum ports therein. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus for transporting a semiconductor wafer, comprising:
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a handle;
a grip portion at an end of the handle, the grip portion having a recessed area in an upper surface thereof and a plurality of vacuum ports in an upper surface of the recessed area. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An apparatus for transporting a semiconductor wafer, comprising:
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a handle; and
a grip portion having a plurality of vacuum ports therein, the vacuum ports generally lying on a circle having a diameter slightly less than a diameter of the wafer. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. An apparatus for transporting a semiconductor wafer, comprising:
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a handle; and
a grip portion at an end of the handle, the grip portion comprising a main body and a plurality of fingers extending from the main body, the grip portion having a plurality of vacuum ports in an upper surface thereof and a wafer support adjacent each of the vacuum ports, the wafer supports being arranged to contact the wafer only at an edge of the wafer. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33)
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Specification