Electroluminescent lamp module and processing method

• US 20030234620A1
• Filed: 06/19/2002
• Published: 12/25/2003
• Est. Priority Date: 06/19/2002
• Status: Active Grant

• Current Assignee: Morgan Adhesives Company (Amcor Plc)
• Original Assignee: Morgan Adhesives Company (Amcor Plc)
• Inventors: Tucholski, Gary R., Pennaz, Thomas J.
• Granted Patent: US 6,922,020 B2
• Time in Patent Office: Days
• US Class Current: 315/169.3
• CPC Class Codes: H05B 44/00 Circuit arrangements for operating electroluminescent light sources for operating light emitting diodes H05B45/00
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

The present invention is an EL lamp module and a method of producing an EL lamp module. The EL lamp module of the present invention provides both an EL lamp (attachable or printed) and required electrical components for the proper function of the EL lamp in a single structure, thereby eliminating the necessity of separate electrical and mechanical connections for the final application of an EL lamp. The EL lamp module includes a printed circuit pattern and printed electrical components, and/or electrical components that may be connected through conventional printing techniques utilizing conductive and non-conductive pressure sensitive adhesives.

Claims

1. An electroluminescent lamp module comprising:

a) a base substrate having a top surface and a bottom surface;

b) an electroluminescent lamp on the base substrate; and

c) an electroluminescent lamp circuit on the base substrate the electroluminescent lamp circuit including a circuit pattern and a plurality of electrical components;

wherein the circuit pattern is printed in a predetermined pattern on the base substrate and is designed to receive later applied electrical components.

2. The electroluminescent lamp module of claim 1 wherein the electroluminescent lamp is printed on the base substrate and comprises a rear lamp electrode layer, a dielectric layer, a phosphor layer and a transparent top lamp electrode layer;

the rear lamp electrode layer and transparent top lamp electrode layer being electrically connected to the circuit pattern.

3. The electroluminescent lamp module of claim 2 wherein the electroluminescent lamp further includes a top bus bar.

4. The electroluminescent lamp module of claim 2 wherein the rear lamp electrode layer and the circuit pattern are printed on the base substrate with an ink including one or more materials selected from indium tin oxide, antimony oxide, silver and carbon ink.

5. The electroluminescent lamp module of claim 2 wherein the circuit pattern includes a plurality of spaced electrical leads, at least one of the plurality of leads having a terminal landing pad capable of registering with the later applied electrical component.

6. The electroluminescent lamp module of claim 2 wherein the electroluminescent lamp circuit includes at least one printed electrical component selected from the group consisting of resistors, capacitors and batteries.

7. The electroluminescent lamp module of claim 2 wherein the electroluminescent lamp circuit includes an integrated circuit inverter chip, the integrated circuit inverter chip including a plurality of electrical contacts, the plurality of electrical contacts of the integrated circuit inverter chip being adhered to and electrically connected to a plurality of spaced electrical leads in the circuit pattern utilizing conductive adhesive.

8. The electroluminescent lamp module of claim 7 wherein the integrated circuit inverter chip is adhered to an interposer and the interposer is adhered to and electrically connected to a plurality of spaced electrical leads in the circuit pattern.

9. The electroluminescent lamp module of claim 2 wherein the plurality of electrical components is selected from the group consisting of integrated circuit inverter chips, resistors, capacitors, diodes, switches and power packs.

10. The electroluminescent lamp module of claim 2 further including a protective coating over at least a portion of the module as an outermost layer.

11. The electroluminescent lamp module of claim 1 wherein the electroluminescent lamp comprises a pre-manufactured label having a rear lamp electrode contact and a transparent top lamp electrode contact, the label being adhered to the base substrate such that the rear lamp electrode contact and the transparent top lamp electrode contact are electrically connected to a complimentary rear lamp electrode lead and a transparent top lamp electrode lead of the circuit pattern.

12. The electroluminescent lamp module of claim 11 wherein the pre-manufactured label comprises a rear lamp electrode layer, a dielectric layer, a phosphor layer and a transparent top lamp electrode layer;

wherein the rear lamp electrode layer and transparent top lamp electrode layer are electrically connected to the circuit pattern.

13. The electroluminescent lamp module of claim 12 wherein the dielectric layer comprises a film selected from the group consisting of polyethylene terephthalate and polypropylene.

14. The electroluminescent lamp module of claim 11 wherein the circuit pattern is printed on the base substrate with an ink including one or more materials selected from indium tin oxide, antimony oxide, silver and carbon ink.

15. The electroluminescent lamp module of claim 11 wherein the circuit pattern includes a plurality of spaced electrical leads, and wherein at least one of the plurality of leads includes a terminal landing pad adapted to register with the later applied electrical component.

16. The electroluminescent lamp module of claim 11 wherein the electroluminescent lamp circuit includes at least one printed electrical component selected from the group consisting of resistors, capacitors and batteries.

17. The electroluminescent lamp module of claim 11 wherein the electroluminescent lamp circuit includes an integrated circuit inverter chip, the integrated circuit inverter chip including a plurality of electrical contacts, and wherein the plurality of electrical contacts are adhered to and electrically connected to a plurality of spaced electrical leads in the circuit pattern.

18. The electroluminescent lamp module of claim 17 wherein the integrated circuit inverter chip is adhered to an interposer and the interposer is adhered to and electrically connected to a plurality of spaced electrical leads in the circuit pattern utilizing conductive pressure sensitive adhesive.

19. The electroluminescent lamp module of claim 11 wherein the plurality of electrical components are selected from the group consisting of integrated circuit inverter chips, resistors, capacitors, diodes, switches and power packs.

20. The electroluminescent lamp module of claim 11 further including a protective coating over at least a portion of the module as an outermost layer.

21. A method of making an electroluminescent lamp module having an electroluminescent lamp comprising a rear lamp electrode layer, a dielectric layer, a phosphor layer, and a top lamp electrode layer and an electroluminescent lamp circuit comprising a circuit pattern and a plurality of electrical components having a plurality of electrical contacts, the method comprising the steps of:

(a) providing a base substrate having a top surface and a bottom surface;

(b) printing the circuit pattern with a conductive material on one of the top or bottom surfaces, the circuit pattern including a plurality of electrical leads, the plurality of electrical leads adapted to electrically connect with the electrical contacts of the electrical components and with the rear lamp electrode layer and transparent top lamp electrode layer, the circuit pattern including a rear lamp electrode lead and a top lamp electrode lead;

(c) printing the electroluminescent lamp on the base substrate such that the rear lamp electrode layer is adapted to register with and be in electrical connection with the rear electrode lead and the transparent top lamp electrode layer is adapted to register with and be in electrical connection with the top lamp electrode lead; and

(d) electrically connecting the plurality of electrical components to the circuit pattern by adhering with conductive adhesive.

22. The method of claim 21 wherein the electroluminescent lamp further includes a top bus bar, the top bus bar being printed on the transparent top lamp electrode layer and extending beyond the transparent top lamp electrode layer and registering in electrical connection with the top lamp electrode lead.

23. The method of claim 21 wherein the rear lamp electrode layer and the circuit pattern are printed during the same printing step.

24. The method of claim 21 wherein the conductive adhesive is pattern printed over portions of the circuit pattern prior to electrically connecting the plurality of electrical components.

25. The method of claim 21 wherein the plurality of electrical components includes at least one printed component selected from the group consisting of transistors, capacitors and batteries.

26. The method of claim 21 further comprising the step of printing a non-conductive pressure sensitive adhesive over areas of the circuit pattern that are not to make electrical contact with the plurality of electrical components.

27. The method of claim 21 wherein the electroluminescent lamp circuit and the electroluminescent lamp are on separate sides of the base substrate, the electrode layers and electrode leads being electrically connected by way of through-hole printing.

28. The method of claim 21 wherein the plurality of electrical components is selected from the group consisting of transistors, capacitors, diodes, batteries and integrated inverter chips.

29. The method of claim 21 wherein at least one of the plurality of electrical components is an integrated circuit inverter chip.

30. The method of claim 29 wherein the integrated circuit inverter chip is part of an inverter chip-interposer sub-assembly.

31. The method of claim 30 wherein the step of electrically connecting the plurality of electrical components to the circuit pattern is performed with respect to the inverter chip-interposer sub-assembly by locating the inverter chip-interposer sub-assembly over a portion of the circuit pattern and electrically connecting the inverter chip-interposer sub-assembly to the circuit pattern by placing the inverter chip-interposer sub-assembly in contact with the circuit pattern by way of conductive pressure sensitive adhesive.

32. The method of claim 21 wherein the dielectric layer is a thin film selected from the group consisting of polyethylene terephthalate and polypropylene.

33. A method of making an electroluminescent lamp module, the module having an electroluminescent lamp comprising a rear lamp electrode layer, a dielectric layer, a phosphor layer, and a transparent top lamp electrode layer and an electroluminescent lamp circuit comprising a circuit pattern and a plurality of electrical components, the plurality of electrical components each having electrical contacts, the method comprising the steps of:

(a) providing a base substrate having a top surface and a bottom surface;

(b) printing the circuit pattern with a conductive material on one of the top or bottom surfaces, the circuit pattern including a plurality of electrical leads, the plurality of electrical leads adapted to electrically connect with the electrical contacts, the rear lamp electrode layer and the transparent top lamp electrode layer, the circuit pattern including a rear lamp electrode lead and a top lamp electrode lead;

(c) applying at least a partially pre-constructed label to the base substrate to form said electroluminescent lamp; and

(d) electrically connecting the plurality of electrical components to the circuit pattern by adhering with conductive adhesive.

34. The method of claim 33 wherein the rear lamp electrode layer is printed on the base substrate during the same printing step as the circuit pattern.

35. The method of claim 33 wherein the electroluminescent lamp further includes a top bus bar, the top bus bar being printed on the transparent top lamp electrode layer and extending beyond the transparent top lamp electrode layer and registering in electrical connection with the top lamp electrode lead.

36. The method of claim 33 wherein the conductive adhesive is pattern printed over portions of the circuit pattern prior to electrically connecting the plurality of electrical components.

37. The method of claim 33 wherein the plurality of electrical components includes at least one printed component selected from the group consisting of transistors, capacitors and batteries.

38. The method of claim 33 further comprising the step of printing a non-conductive pressure sensitive adhesive over areas of the circuit pattern that are to make electrical contact with the plurality of electrical components to aid in the mechanical attachment of the plurality of electrical components.

39. The method of claim 33 wherein the electroluminescent lamp circuit and the electroluminescent lamp are on separate sides of the base substrate, the lamp electrode layers and electrode leads being electrically connected by way of through-hole printing.

40. The method of claim 33 wherein the plurality of electrical components are selected from the group consisting of transistors, capacitors, diodes, batteries and integrated inverter chips.

41. The method of claim 33 wherein at least one of the plurality of electrical components is an integrated circuit inverter chip.

42. The method of claim 41 wherein the one integrated circuit inverter chip is part of an inverter chip-interposer sub-assembly.

43. The method of claim 42 wherein the step of electrically connecting the plurality of electrical components to the circuit pattern is performed with respect to the inverter chip-interposer sub-assembly by locating the inverter chip-interposer sub-assembly over a portion of the circuit pattern and electrically connecting the inverter chip-interposer sub-assembly to the circuit pattern by placing the inverter chip-interposer sub-assembly in contact with the circuit pattern, the portion of the circuit pattern having a printed layer of conductive pressure sensitive adhesive disposed thereon.

44. An electroluminescent label that can be mechanically applied and electrically connected to a surface with pressure sensitive adhesive, the label comprising:

a support substrate having a top surface and a bottom surface;

a rear lamp electrode layer on the top surface of the support substrate;

a thin film dielectric on a portion of the rear lamp electrode layer, the thin film dielectric positioned such that a portion of the rear lamp electrode remains exposed on the top surface of the support substrate;

a phosphor layer on the thin film dielectric;

a top lamp electrode layer on the phosphor layer, the top lamp electrode layer including a top lamp electrode contact;

a conductive adhesive on the exposed portion of the rear lamp electrode and the top lamp electrode contact; and

a non-conductive adhesive on a portion of the top lamp electrode layer except for the top lamp electrode contact.

45. The electroluminescent label of claim 44, wherein the thin film dielectric comprises a polymeric film.

46. The electroluminescent label of claim 45, wherein the polymeric film is polyethylene terephthalate.

47. The electroluminescent label of claim 44 further comprising a release liner over the adhesives.

48. The electroluminescent label of claim 44 further comprising a top lamp electrode bus bar on the top lamp electrode layer, the top lamp electrode bus bar including a top bus bar contact having conductive pressure sensitive adhesive thereon.

49. The electroluminescent label of claim 44, further comprising a rear lamp electrode bus bar.

50. The electroluminescent label of claim 44, wherein both lamp electrode layers are transparent.

51. The electroluminescent label of claim 44, further comprising transparent lacquer on the top lamp electrode and non-conductive pressure sensitive adhesive on the transparent lacquer.

53. A method of making a thin film dielectric electroluminescent label comprising the steps of:

providing a support substrate having a top surface and a bottom surface;

depositing a rear lamp electrode layer on the top surface of the support substrate, the rear lamp electrode layer including a rear lamp electrode contact;

laminating a thin dielectric film to the rear lamp electrode layer such that the rear lamp electrode contact remains uncovered;

depositing a phosphor layer on the thin film dielectric;

depositing a top lamp electrode layer on the phosphor layer;

depositing a top lamp electrode bus bar in a pattern on the top lamp electrode layer, the top lamp electrode bus bar including a top bus bar contact;

applying a conductive adhesive on the contacts; and

applying a non-conductive adhesive on areas other than the contacts, wherein at least one of the rear and top lamp electrodes is transparent.

54. The method of claim 53, wherein the rear lamp electrode layer, the phosphor layer and the top lamp electrode layer are deposited with flexographic printing.

55. The method of claim 53, wherein the top lamp electrode layer is transparent.

56. The method of claim 53, wherein the thin film dielectric is a polymeric film.

57. The method of claim 56, wherein the polymeric film is polyethylene terephthalate.

58. The method of claim 53, further comprising the step of applying a release liner over the adhesives.

59. The method of claim 53, further comprising the step of depositing a rear lamp electrode bus bar on the support substrate prior to depositing the rear electrode layer, the rear electrode layer comprising a transparent conductive material.

60. An electroluminescent label that can be mechanically applied and electrically connected to a surface with pressure sensitive adhesive, the label comprising:

a support substrate having a top surface and a bottom surface;

a bottom bus bar on the support substrate;

a transparent lamp electrode layer on the bottom bus bar;

a phosphor layer on the transparent lamp electrode layer;

a thin film dielectric layer applied over the phosphor layer such that a portion of at least the bottom bus bar remains uncovered;

a rear lamp electrode layer on the thin film dielectric; and

a conductive adhesive on the exposed portion of the bottom bus bar and at least a portion of the rear lamp electrode layer.

61. The electroluminescent label of claim 60, wherein the thin film dielectric is a polymeric film.

62. The electroluminescent label of claim 61, wherein the polymeric film is polyethylene terephthalate.

63. The electroluminescent label of claim 60 further comprising a release liner over the adhesive.

64. The electroluminescent label of claim 60 further comprising a non-conductive adhesive pattern on areas of the label other than those covered by conductive adhesive.

65. The electroluminescent label of claim 60 further comprising a rear lamp electrode bus bar on the rear lamp electrode layer, the rear lamp electrode layer comprising a transparent conductive material.

66. A method of making an electroluminescent lamp module having an electroluminescent lamp comprising a rear lamp electrode layer, a dielectric layer, a phosphor layer, and a top lamp electrode layer and an electroluminescent lamp circuit comprising a circuit pattern and a plurality of electrical components having electrical contacts, the method comprising the steps of:

(a) providing a base substrate having a top surface and a bottom surface;

(b) printing the circuit pattern with a conductive material on one of the top or bottom surfaces, the circuit pattern including a plurality of electrical leads, the plurality of electrical leads adapted to electrically connect with the electrical contacts of the electrical components and with the rear lamp electrode layer and top lamp electrode layer, the circuit pattern including a rear lamp electrode lead and a top lamp electrode lead;

(c) printing the rear lamp electrode layer on the base substrate;

(d) applying the dielectric layer as a thin polymeric film over the rear lamp electrode layer;

(e) printing the phosphor layer on the thin polymeric film dielectric;

(f) printing the top lamp electrode layer on the phosphor layer; and

(g) electrically connecting the plurality of electrical components to the circuit pattern by adhering with conductive adhesive.

67. The method of claim 66 wherein the electroluminescent lamp further includes a top bus bar, the top bus bar being printed on the top lamp electrode layer, the top lamp electrode layer comprising a transparent conductive material.

68. The method of claim 66 wherein the thin polymeric film is selected from the group consisting of polyethylene terephthalate and polypropylene.

69. The method of claim 66 wherein the electroluminescent lamp is formed by (a) printing a bottom bus bar on the base substrate, (b) printing the top electrode layer over the bottom bus bar, (c) printing the phosphor layer over the top electrode layer, (d) applying the dielectric layer in the form of a thin polymeric film over the phosphor layer, and (e) printing the rear electrode layer on the thin polymeric film.

70. An electroluminescent lamp comprising:

a support substrate having a top surface and a bottom surface;

a rear lamp electrode layer on the top surface of the support substrate;

a thin film dielectric on the rear lamp electrode layer, the thin film dielectric applied such that a portion of the rear lamp electrode layer remains exposed on the top surface of the support substrate;

a phosphor layer on the thin film dielectric; and

a top lamp electrode layer on the phosphor layer, the top lamp electrode layer including a top lamp electrode contact.

71. An electroluminescent lamp comprising:

a support substrate having a top surface and a bottom surface;

a bottom bus bar on the support substrate;

a transparent lamp electrode layer on the bottom bus bar;

a phosphor layer on the transparent lamp electrode layer;

a thin film dielectric layer laminated over the phosphor layer such that a portion of the bottom bus bar remains uncovered; and

a rear lamp electrode layer on the thin film dielectric.