Optical apparatus and method for making the same
First Claim
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1. An optical apparatus comprising:
- a substrate having a first surface, a second surface opposite to said first surface, and a light passage formed through said first and second surfaces;
an optical semiconductor device including a semiconductor package including a base wall, a surrounding wall extending from a periphery of said base wall and cooperating with said base wall to form a chip-receiving space, and a cover member disposed opposite to said base wall and secured to said surrounding wall for closing said chip-receiving space, said cover member having a wall-connecting surface connected to said surrounding wall and a substrate-abutting surface that abuts directly against said first surface of said substrate, said cover member having a light-guiding portion that is optically aligned with said light passage to permit passage of light into said chip-receiving space, a lead frame including a chip carrier mounted on said base wall in said chip-receiving space, and a plurality of leads, each of which has a chip-connecting portion disposed in said chip-receiving space, and a substrate-connecting portion extending through said surrounding wall and mounted on said substrate to secure said optical semiconductor device on said first surface of said substrate, and an optical semiconductor chip having a carrier-mounting portion and a light-sensing portion opposite to said carrier-mounting portion, said carrier-mounting portion being mounted on said chip carrier such that said light-sensing portion is optically aligned with said light guiding portion, said optical semiconductor chip being connected electrically to said chip-connecting portions of said leads such that electrical connection between said optical semiconductor chip and said substrate is possible through said leads; and
a lens assembly including a lens frame and a lens set mounted in said lens frame, said lens frame having a mounting surface mounted on said second surface of said substrate such that said lens set is optically aligned with said light passage;
wherein said surrounding wall has a height and said cover member has a thickness that cooperate to form an optimum optical distance between said lens set and said light-sensing portion of said optical semiconductor chip.
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Abstract
An optical apparatus includes an optical semiconductor device and a lens assembly mounted on opposite surfaces of a substrate. The height of a surrounding wall and the thickness of a cover member of a semiconductor package of the optical semiconductor device are selected so that, when the cover member and the lens assembly abut directly against the opposite surfaces of the substrate, an optimum optical distance will be formed between a lens set of the lens assembly and a light-sensing portion of an optical semiconductor chip in the semiconductor package. A method for making the optical apparatus is also disclosed.
17 Citations
15 Claims
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1. An optical apparatus comprising:
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a substrate having a first surface, a second surface opposite to said first surface, and a light passage formed through said first and second surfaces;
an optical semiconductor device including a semiconductor package including a base wall, a surrounding wall extending from a periphery of said base wall and cooperating with said base wall to form a chip-receiving space, and a cover member disposed opposite to said base wall and secured to said surrounding wall for closing said chip-receiving space, said cover member having a wall-connecting surface connected to said surrounding wall and a substrate-abutting surface that abuts directly against said first surface of said substrate, said cover member having a light-guiding portion that is optically aligned with said light passage to permit passage of light into said chip-receiving space, a lead frame including a chip carrier mounted on said base wall in said chip-receiving space, and a plurality of leads, each of which has a chip-connecting portion disposed in said chip-receiving space, and a substrate-connecting portion extending through said surrounding wall and mounted on said substrate to secure said optical semiconductor device on said first surface of said substrate, and an optical semiconductor chip having a carrier-mounting portion and a light-sensing portion opposite to said carrier-mounting portion, said carrier-mounting portion being mounted on said chip carrier such that said light-sensing portion is optically aligned with said light guiding portion, said optical semiconductor chip being connected electrically to said chip-connecting portions of said leads such that electrical connection between said optical semiconductor chip and said substrate is possible through said leads; and
a lens assembly including a lens frame and a lens set mounted in said lens frame, said lens frame having a mounting surface mounted on said second surface of said substrate such that said lens set is optically aligned with said light passage;
wherein said surrounding wall has a height and said cover member has a thickness that cooperate to form an optimum optical distance between said lens set and said light-sensing portion of said optical semiconductor chip. - View Dependent Claims (2, 3, 4, 5)
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6. An optical apparatus adapted to be mounted on a substrate that has a first surface, a second surface opposite to the first surface, and a light passage formed through the first and second surfaces, said optical apparatus comprising:
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an optical semiconductor device including a semiconductor package including a base wall, a surrounding wall extending from a periphery of said base wall and cooperating with said base wall to form a chip-receiving space, and a cover member disposed opposite to said base wall and secured to said surrounding wall for closing said chip-receiving space, said cover member having a wall-connecting surface connected to said surrounding wall and a substrate-abutting surface adapted to abut directly against the first surface of the substrate, said cover member having a light-guiding portion that is to be disposed in optical alignment with the light passage to permit passage of light into said chip-receiving space when said substrate-abutting surface abuts directly against the first surface of the substrate, a lead frame including a chip carrier mounted on said base wall in said chip-receiving space, and a plurality of leads, each of which has a chip-connecting portion disposed in said chip-receiving space, and a substrate-connecting portion extending through said surrounding wall and adapted to be mounted on the substrate so as to secure said optical semiconductor device on the first surface of the substrate, and an optical semiconductor chip having a carrier-mounting portion and a light-sensing portion opposite to said carrier-mounting portion, said carrier-mounting portion being mounted on said chip carrier such that said light-sensing portion is optically aligned with said light-guiding portion, said optical semiconductor chip being connected electrically to said chip-connecting portions of said leads such that electrical connection between said optical semiconductor chip and the substrate is possible through said leads; and
a lens assembly including a lens frame and a lens set mounted in said lens frame, said lens frame having a mounting surface adapted to be mounted on the second surface of the substrate such that said lens set is disposed in optical alignment with the light passage;
wherein said lens set and said light-sensing portion of said optical semiconductor chip form an optimum optical distance therebetween, said substrate-abutting surface of said cover member and said mounting surface of said lens frame forming a clearance corresponding to the thickness of the substrate to permit said substrate-abutting surface and said mounting surface to abut directly and respectively against the first and second surfaces of the substrate when said optical apparatus is mounted on the substrate. - View Dependent Claims (7, 8, 9, 10)
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11. A method for making an optical apparatus, comprising the steps of:
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(a) preparing a substrate having a first surface, a second surface opposite to said first surface, and a light passage formed through said first and second surfaces;
(b) preparing an optical semiconductor device that includes a semiconductor package including a base wall, a surrounding wall extending from a periphery of said base wall and cooperating with said base wall to form a chip-receiving space, and a cover member disposed opposite to said base wall and secured to said surrounding wall for closing said chip-receiving space, said cover member having a wall-connecting surface connected to said surrounding wall and a substrate-abutting surface opposite to said wall-connecting surface, said cover member having a light-guiding portion that permits passage of light into said chip-receiving space, a lead frame including a chip carrier mounted on said base wall in said chip-receiving space, and a plurality of leads, each of which has a chip-connecting portion disposed in said chip-receiving space, and a substrate-connecting portion extending through said surrounding wall, and an optical semiconductor chip having a carrier-mounting portion and a light-sensing portion opposite to said carrier-mounting portion, said carrier-mounting portion being mounted on said chip carrier such that said light-sensing portion is optically aligned with said light guiding portion, said optical semiconductor chip being connected electrically to said chip-connecting portions of said leads;
(c) mounting said optical semiconductor device on said substrate such that said substrate-abutting surface abuts directly against said first surface of said substrate, such that said light-guiding portion is optically aligned with said light passage, and such that said substrate-connecting portions of said leads are mounted on said substrate so as to secure said optical semiconductor device on said substrate and so as to establish electrical connection between said optical semiconductor chip and said substrate;
(d) preparing a lens assembly that includes a lens frame and a lens set mounted in said lens frame; and
(e) mounting a mounting surface of said lens frame on said second surface of said substrate such that said lens set is optically aligned with said light passage and forms an optimum optical distance with said light-sensing portion of said optical semiconductor chip. - View Dependent Claims (12, 13, 14, 15)
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Specification