MEMS device integrated chip package, and method of making same

• US 20040016989A1
• Filed: 07/21/2003
• Published: 01/29/2004
• Est. Priority Date: 10/12/2000
• Status: Active Grant

• Current Assignee: Peng Cheng, Qing Ma, Valluri Rao
• Original Assignee: Peng Cheng, Qing Ma, Valluri Rao
• Inventors: Ma, Qing, Rao, Valluri, Cheng, Peng
• Granted Patent: US 7,291,561 B2
• Time in Patent Office: Days
• US Class Current: 257/528
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: H01G 5/16 using variation of distance between electrodes
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 428/24248 One piece

Abstract

The present invention relates to a chip package that includes a semiconductor device and at least one micro electromechanical structure (MEMS) such that the semiconductor device and the MEMS form an integrated package. One embodiment of the present invention includes a semiconductor device, a first MEMS device disposed in a conveyance such as a film, and a second MEMS device disposed upon the semiconductor device through a via in the conveyance.

The present invention also relates to a process of forming a chip package that includes providing a conveyance such as a tape automated bonding (TAB) structure, that may hold at least one MEMS device. The method is further carried out by disposing the conveyance over the active surface of the device in a manner that causes the at least one MEMS to communicate electrically to the active surface. Where appropriate, a sealing structure such as a solder ring may be used to protect the MEMS.

Claims

1. A micro electromechanical (MEMS) package comprising:

a semiconductor device;

a first MEMS disposed in a first structure, and wherein the first MEMS is disposed over the semiconductor device;

an embedded MEMS in a conveyance that is disposed over the semiconductor device, wherein first MEMS is accommodated in a via in the conveyance.

2. The MEMS package according to claim 1, wherein the first MEMS is selected from a capacitor, a switch, a power supply, and an oscillator.

3. The MEMS package according to claim 1 further comprising:

encapsulation material disposed over the first MEMS and the conveyance.

4. The MEMS package according to claim 1, wherein the semiconductor device further comprises:

an active surface;

a first electrical contact array upon the active surface;

a second electrical contact array upon the active surface; and

further comprising;

a sealing structure surrounding the first electrical contact array.

5. The MEMS package according to claim 1, wherein the semiconductor device further comprises:

an active surface;

a first electrical contact array upon the active surface;

a second electrical contact array upon the active surface; and

further comprising;

a sealing structure disposed around the first electrical contact array, wherein the sealing structure comprises a solder ring.

6. The MEMS package according to claim 5, wherein the sealing structure is disposed between the active surface and the first MEMS.

7. The MEMS package according to claim 1, wherein the first MEMS is at least one variable capacitor.

8. The MEMS package according to claim 1, wherein the first MEMS is at least one variable capacitor and further comprising:

at least one third MEMS selected from a switch, a capacitor, a variable capacitor, an oscillator, a power supply, and combinations thereof

9. The MEMS package according to claim 8, wherein the third MEMS is disposed in a third structure that is spaced apart from the first MEMS.

10. The MEMS package according to claim 1, wherein the first MEMS is selected from a bridge oscillator, a cantilever oscillator, and combinations thereof.

11. The MEMS package according to claim 1, wherein the first MEMS is a hollow oscillator.

12. The MEMS package according to claim 1 further comprising:

encapsulation material disposed over the semiconductor device.

13. The MEMS package according to claim 1, wherein the first structure comprises material selected from monocrystalline silicon, polysilicon, silicon on oxide, and silicon on sapphire.

14. A process of forming a micro electromechanical (MEMS) package comprising:

providing a semiconductor device;

providing a conveyance with at least one embedded MEMS device disposed therein; and

disposing the conveyance over the semiconductor device, wherein the at least one embedded MEMS device communicates electrically to the semiconductor device.

15. The process according to claim 14, wherein the at least one embedded MEMS device is selected from a switch, a capacitor, an inductor, an oscillator, a power supply, and combinations thereof.

16. The process according to claim 14, wherein the conveyance comprises a via disposed therein, the process further comprising:

providing at least one detached MEMS device in a first structure; and

accommodating the at least one detached MEMS device through the via, upon the active surface.

17. The process according to claim 14, wherein the conveyance comprises a via disposed therein, the process further comprising:

providing at least one detached MEMS device in a first structure;

placing the at least one detached MEMS device on the semiconductor device; and

accommodating the at least one detached MEMS device through the via, upon the active surface.

18. The process according to claim 14, wherein the conveyance comprises a via disposed therein, the process further comprising:

providing at least one detached MEMS device in a first structure;

accommodating the at least one detached MEMS device upon the active surface;

providing a sealing structure; and

disposing the sealing structure in a manner sufficient to isolate at least one of the at least one detached MEMS device.

19. The process according to claim 14 further comprising:

forming an integrated package comprising the semiconductor device and the conveyance.

20. The process according to claim 14 further comprising:

forming an integrated package comprising the semiconductor device, the conveyance, and at least one detached MEMS device in a first structure, wherein the at least one detached MEMS device is accommodated upon the semiconductor device.

21. The process according to claim 20 further comprising:

encapsulating the detached MEMS device and the conveyance to form an integrated package.

22. The process according to claim 14 further comprising:

encapsulating the semiconductor device to form an integrated package, wherein the at least one detached MEMS device is accommodated upon the semiconductor device.

23. A process comprising:

providing a semiconductor device;

accommodating a detached micro electromechanical structure (MEMS) device upon the semiconductor device;

providing a conveyance over the semiconductor device and around the detached MEMS device; and

contacting encapsulation material with at least one of the semiconductor device, the detached MEMS device, and the conveyance to form an integrated MEMS package.

24. The process according to claim 23, further comprising:

embedding a MEMS device in the conveyance.

25. The process according to claim 23, further comprising:

providing a sealing structure; and

interposing the sealing structure upon the semiconductor device in a manner sufficient to isolate at least one of the at least one detached MEMS device.

26. A micro electromechanical structure (MEMS) package comprising:

a semiconductor device;

a sealing structure disposed over the semiconductor device;

at least one detached MEMS in a first structure disposed over the sealing structure, wherein the at least one detached MEMS is selected from a capacitor, a switch, an oscillator, an inductor, a power supply, and combinations thereof;

at least one embedded MEMS in a conveyance, wherein the at least one embedded MEMS is selected from a capacitor, a switch, an oscillator, an inductor, a power supply, and combinations thereof; and

encapsulation material disposed over at least one of the conveyance and at least one of the at least one detached MEMS, and the semiconductor device.

27. The MEMS package according to claim 26, wherein the semiconductor device further comprises:

an active surface;

a first electrical contact array upon the active surface;

a second electrical contact array upon the active surface;

wherein the at least one detached MEMS makes electrical contact with the first electrical contact array, and wherein the at least one embedded MEMS makes electrical contact with the second electrical contact array.

28. The MEMS package according to claim 26, wherein a first of the at least one detached MEMS is a variable capacitor and a second of the at least one detached MEMS is selected from a switch, a capacitor, a variable capacitor, an oscillator, and a power supply.

29. The MEMS package according to claim 26, wherein the at least one detached MEMS is selected from a bridge oscillator, a cantilever oscillator, a hollow bridge oscillator, a hollow cantilever oscillator, and combinations thereof.

30. The MEMS package according to claim 26, wherein the at least one embedded MEMS is selected from a spiral inductor and a helical inductor.