Circuit package integrating passive radio frequency structure

• US 20040032308A1
• Filed: 05/22/2003
• Published: 02/19/2004
• Est. Priority Date: 08/19/2002
• Status: Active Grant

• Current Assignee: DSP Group Incorporated (Synaptics Incorporated)
• Original Assignee: DSP Group Incorporated (Synaptics Incorporated)
• Inventors: Cheung, Philip, Harjani, Ramesh
• Granted Patent: US 7,138,884 B2
• Time in Patent Office: Days
• US Class Current: 333/26
• CPC Class Codes: H01P 5/10 for coupling balanced lines or devices with unbalanced lines or devices

Abstract

In general, the invention is directed to integration of passive radio frequency (RF) structures with at least one integrated circuit in a single integrated circuit (IC) package. An IC package in accordance with the invention may include, for example, a radio IC, a digital IC, a passive radio frequency balun as well as additional passive RF structures or ICs. Additionally, passive electronic components may further be incorporated in the IC package. For example, the IC package may include a resistor, capacitor, inductor or the like. The components of the IC package may be distributed throughout layers of a multi-layer IC package, such as a multi-layer ceramic package. The different ICs and the passive RF structures may be electrically coupled via conductive traces, which may be varied in thickness and length in order to match input and output impedances of the different ICs and passive RF structures.

Claims

1. A circuit package comprising:

at least one integrated circuit device; and

a passive balun, the integrated circuit device being coupled to the passive balun.

2. The circuit package of claim 1, further comprising a passive filter.

3. The circuit package of claim 2, wherein the filter is electrically coupled to the balun.

4. The circuit package of claim 2, wherein the filter comprises a hairpin filter.

5. The circuit package of claim 2, wherein the filter comprises a notch filter.

6. The circuit package of claim 1, further comprising a passive coupler.

7. The circuit package of claim 1, wherein the passive balun comprises:

an unbalanced balun structure having a first unbalanced component and a second unbalanced component electrically coupled to one another; and

a balanced balun structure having a first balanced component and a second balanced component,

wherein the first balanced component electromagnetically couples more than one side of the first unbalanced component, and the second balanced component electromagnetically couples more than one side of the second unbalanced component.

8. The circuit package of claim 7, wherein the first unbalanced component and the first balanced component are disposed on a first layer of the integrated circuit package, and the second unbalanced component and the second balanced component are disposed on a second layer of the integrated circuit package.

9. The circuit package of claim 8, wherein one or more intermediate layers separate the first and second layers.

10. The circuit package of claim 7, wherein the first and second unbalance components and the first and second balanced components are disposed on a single layer of the integrated circuit package.

11. The circuit package of claim 7, wherein at least one of the first and second unbalanced components is coupled to an unbalanced port.

12. The circuit package of claim 7, wherein the first balanced component is coupled to a first balanced port and the second balanced component is coupled to a second balanced port.

13. The circuit package of claim 7, wherein the first and second balanced components include:

a first balanced element that electromagnetically couples a first side of the unbalanced component; and

a second balanced element that electromagnetically couples a second side of the unbalanced component,

wherein the first balanced element and the second balanced element are electrically coupled.

14. The circuit package of claim 13, wherein the first and second balanced elements comprise conductive strips.

15. The circuit package of claim 7, wherein the first and second unbalanced components are oriented such that the first unbalanced component is parallel with the second unbalanced component.

16. The circuit package of claim 7, wherein the first and second unbalanced components comprise conductive strips.

17. The circuit package of claim 1, further comprising a conductive pad to which connections from the integrated circuit device and the passive balun electrically couple.

18. The circuit package of claim 17, wherein the conductive pad comprises a ball grid array.

19. The circuit package of claim 1, wherein the integrated circuit device includes a digital integrated circuit that processes inbound and outbound baseband frequency signals.

20. The circuit package of claim 1, wherein the integrated circuit includes a radio integrated circuit that transmits and receives inbound and outbound radio frequency signals.

21. The circuit package of claim 1, wherein the integrated circuit and the passive balun reside at least partially on the same layer.

22. The circuit package of claim 1, further comprising at least one passive electronic component.

23. The circuit package of claim 22, wherein the passive electronic component comprises one of a resistor, a capacitor and an inductor.

24. The circuit package of claim 1, wherein the integrated circuit package comprises a multi-layer ceramic integrated circuit package.

25. The circuit package of claim 1, wherein the integrated circuit package operates in a radio frequency range.

26. An integrated circuit package comprising:

a radio integrated circuit that converts radio frequency signals to baseband signals;

a digital integrated circuit that processes the inbound and outbound baseband frequency signals; and

a passive structure coupled to the radio integrated circuit.

27. The package of claim 26, wherein the passive structure comprises a passive balun.

28. The package of claim 27, wherein passive balun includes:

an unbalanced balun structure having a first unbalanced component and a second unbalanced component electrically coupled to one another; and

a balanced balun structure having a first balanced component and a second balanced component,

wherein the first balanced component electromagnetically couples more than one side of the first unbalanced component, and the second balanced component electromagnetically couples more than one side of the second unbalanced component.

29. The package of claim 28, wherein the first unbalanced component and the first balanced component are disposed on a first layer of the integrated circuit package, and the second unbalanced component and the second balanced component are disposed on a second layer of the integrated circuit package.

30. The package of claim 28, wherein the first and second unbalance components and the first and second balanced components are disposed on a single layer of the integrated circuit package.

31. The package of claim 27, wherein the balun is electrically coupled to a passive filter.

32. The package of claim 26, wherein the passive structure comprises a passive filter.

33. The package of claim 32, wherein the passive filter comprises one of a notch filter and a hairpin filter.

34. The package of claim 26, wherein the passive structure comprises a passive coupler.

35. The package of claim 26, wherein the multi-layer integrated circuit package further includes a passive electrical component.

36. The package of claim 26, wherein the passive electrical component comprises one of a capacitor, a resistor, and an inductor.

37. The package of claim 26, wherein the integrated circuit package comprises a multi-layer ceramic package.

38. The package of claim 26, further comprising conductive traces that interconnect the radio integrated circuit, the digital integrated circuit and the passive structure.

39. The package of claim 26, wherein the multi-layer integrated circuit package includes a conductive pad to which connections from the radio integrated circuit, the digital integrated circuit and the passive structure electrically couple.

40. The package of claim 39, wherein the conductive pad comprises a ball grid array.

41. The circuit package of claim 26, wherein the integrated circuit package operates in a radio frequency range.