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Method for effectively embedding various integrated circuits within field programmable gate arrays

  • US 20040040005A1
  • Filed: 01/17/2003
  • Published: 02/26/2004
  • Est. Priority Date: 01/17/2002
  • Status: Active Grant
First Claim
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1. An improvement in an apparatus comprising a plurality of pre-formed IC chips encapsulated in stackable layers in an electronic package, including at least one field programmable gate array (FPGA), the improvement comprising:

  • a field programmable gate array (FPGA); and

    at least one auxiliary logic component coupled to the FPGA with at least one intercommunicated clock, control and/or data signal between the FPGA and the auxiliary logic component.

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