Method for effectively embedding various integrated circuits within field programmable gate arrays
First Claim
1. An improvement in an apparatus comprising a plurality of pre-formed IC chips encapsulated in stackable layers in an electronic package, including at least one field programmable gate array (FPGA), the improvement comprising:
- a field programmable gate array (FPGA); and
at least one auxiliary logic component coupled to the FPGA with at least one intercommunicated clock, control and/or data signal between the FPGA and the auxiliary logic component.
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Accused Products
Abstract
A chip stack includes a field programmable gate array (FPGA) and an auxiliary component coupled to the FPGA with intercommunicated clock, control and/or data signals. The auxiliary component has a functionality mapped into the FPGA. The pin definition of the FPGA is redefined so that the FPGA and the auxiliary component in combination operate as a modified FPGA. A test circuit is programmed into the FPGA to exercise the auxiliary component to test functionality and timing performance at full speed. The functionality of the auxiliary component mapped into the FPGA is parameterized, such as for the data word width for reading and/or writing data words of different lengths into the auxiliary component in both an aligned and nonaligned manner. A memory interface allows multiple auxiliary circuits to be accessed through the FPGA either together to generate a wider data word or serially to achieve a greater memory depth.
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Citations
37 Claims
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1. An improvement in an apparatus comprising a plurality of pre-formed IC chips encapsulated in stackable layers in an electronic package, including at least one field programmable gate array (FPGA), the improvement comprising:
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a field programmable gate array (FPGA); and
at least one auxiliary logic component coupled to the FPGA with at least one intercommunicated clock, control and/or data signal between the FPGA and the auxiliary logic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 33)
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- 20. An improvement in a method of operating a field programmable gate array (FPGA) included in a plurality of pre-formed IC chips encapsulated in stackable layers in an electronic package, the improvement comprising intercommunicating the field programmable gate array (FPGA) and at least one auxiliary logic component coupled to the FPGA through at least one common clock, control and/or data signal between the FPGA and the auxiliary logic component.
Specification