Dissipative ceramic bonding tool tip

• US 20040046007A1
• Filed: 08/27/2003
• Published: 03/11/2004
• Est. Priority Date: 02/25/1999
• Status: Active Grant

• Current Assignee: Anza Technology, Inc.
• Original Assignee: Mary L Reiber, Steven-Frederick Reiber
• Inventors: Reiber, Steven-Frederick, Reiber, Mary Louise
• Granted Patent: US 6,935,548 B2
• Time in Patent Office: Days
• US Class Current: 228/180.5
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 20/005 Capillary welding
• CPC Class Codes: B23K 20/025 Bonding tips therefor
• CPC Class Codes: B23K 2101/32 Wires
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/78302 Shape
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85238 using electric resistance welding, i.e. ohmic heating
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01007 Nitrogen [N]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/0104 : Zirconium [Zr]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01105 : Rare earth metals
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30105 : Capacitance

Abstract

Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×10⁴ or 10⁵ to 10¹² ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.

Claims

1. A device comprising:

a tip of a bonding tool having a dissipative material for use in wire bonding machines for connecting leads to integrated circuit bonding pads, wherein the tip has a static discharge time between 0.1 and 0.5 seconds.

2. A device comprising:

a bonding tool tip having an electrically dissipative ceramic for use in capillary wedge-type wire bonding machines for connecting leads to integrated circuit bonding pads.

3. A method of using a bonding tool tip, comprising:

providing an electrically dissipative bonding tool tip;

bonding a material to a device;

allowing an essentially smooth current to dissipate to the device, the current being low enough so as not to damage said device being bonded and high enough to avoid a build up of charge that could discharge to the device being bonded and damage the device being bonded.