Method and apparatus for the compensation of edge ring wear in a plasma processing chamber

  • US 20040053428A1
  • Filed: 09/18/2002
  • Published: 03/18/2004
  • Est. Priority Date: 09/18/2002
  • Status: Active Grant
First Claim
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1. A method for processing a plurality of substrates in a plasma processing chamber of a plasma processing system, each of said substrate being disposed on a chuck and surrounded by an edge ring during said processing, comprising:

  • processing a first substrate of said plurality of substrates in accordance to a given process recipe in said plasma processing chamber;

    thereafter adjusting a capacitance value of a capacitance along a capacitive path between a plasma sheath in said plasma processing chamber and said chuck through said edge ring by a given value; and

    , processing a second substrate of said plurality of substrates in accordance to said given process recipe in said plasma processing chamber after said adjusting, wherein said adjusting is performed without requiring a change in said edge ring.

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