Thin type camera module

  • US 20040056971A1
  • Filed: 09/12/2003
  • Published: 03/25/2004
  • Est. Priority Date: 09/23/2002
  • Status: Abandoned Application
First Claim
Patent Images

1. A thin type camera module comprising:

  • a fixing board;

    an imaging-sensing semiconductor assembly comprising a COF (chip-on film) wiring film and an image sensing chip, wherein the COF wiring film has a surface, a window and a plurality of connecting ends disposed on the surface of the COF wiring film around the window, the image sensing chip has a photosensitive surface corresponding to the window, and a plurality of bumps are formed on peripherals of the photosensitive surface, the image sensing chip is flip-chip mounted on the COF wiring film to electrically connect the bumps with the connecting ends; and

    a lens holder for connecting a camera lens, wherein the lens holder has a light-pervious channel and is connected with the fixing board to form a airtight space for sealing the image sensing chip, and the photosensitive surface of the image sensing chip is corresponding to the light-pervious channel for capturing image.

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