Sideway-projecting light emitting diode structure

• US 20040057254A1
• Filed: 09/19/2002
• Published: 03/25/2004
• Est. Priority Date: 09/19/2002
• Status: Active Grant

• Current Assignee: Para Light Electronics Co., Ltd.
• Original Assignee: Para Light Electronics Co., Ltd.
• Inventors: Lin, Ming-Te
• Granted Patent: US 6,799,870 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A sideway-projecting light emitting diode (LED) includes an enclosure made of a light-transmitting material having first and second opposite side faces The first side face forms a light-focusing portion First and second conductive terminals are fixed in the enclosure and have tails extending beyond the second side face. A support member made of conductive materials has an inner end fixed in the enclosure between the first and second terminals and a remote end extending beyond the side face A bowl is formed on the inner end of the support member for receiving and retaining a chip substantially confronting the light-focusing portion and electrically connected to the first and second terminals. A heat dissipation plate is mounted to the remote end of the support member for enhancing heat dissipation of the light emitting diode which in turn allows for increased power consumption of the light emitting diode and increased brightness of the light emitted from the light emitting diode By edge-mounting the light emitting diode to an edge of a circuit board with the tails of the terminals soldered to the circuit board, light emitted from the chip is allowed to project through the light-focusing, portion in a sideway direction with respect to the circuit board.

Claims

1. A light emitting diode comprising

an enclosure made of light-transmitting material and having opposite side faces, a first one of the side faces forming a light-focusing portion;

first and second terminals made of conductive materials and fixed in the enclosure and having tails extending beyond a second one of the side faces for connection with an external device for supply of electrical power to the light emitting diode,

a support member having an inner end fixed in the enclosure and a remote end extending beyond the second side face of the enclosure, the inner end forming a bowl receiving and retaining a chip therein, the chip being electrically connected to the first and second terminals, and

a heat dissipation plate being mounted to the remote end of the support member,

wherein light emitted from the light emitting diode is allowed to project in a sideway direction and heat dissipation is enhanced by the heat dissipation plate

2. The light emitting diode as claimed in claim 1, wherein the first and second terminals are made of metals selected from a group consisting of aluminum, copper and iron to serve as positive and negative terminals of the light emitting diode

3. The light emitting diode as claimed in claim 1, wherein the support member is made of a metal selected from a group consisting of aluminum, copper and iron, the support member being electrically connected to one of the first and second terminals.

4. The light emitting diode as claimed in claim 1, wherein the heat dissipation plate is integrally formed with the support member

5. The light emitting diode as claimed in claim 1, wherein the support member comprises a plate having a first thickness, the heat dissipation plate having a second thickness substantially identical to the first thickness

6. The light emitting diode as claimed in claim 1, wherein the support member comprises a plate having a first thickness, the heat dissipation plate having a second thickness different from the first thickness of the support member whereby a step-like connection is formed between the support member and the heat dissipation plate

7. The light emitting diode as claimed in claim 1, wherein the heat dissipation plate has a variable shape and size

8. The light emitting diode as claimed in claim 1 further comprising an additional heat dissipation member attached to the heat dissipation plate

9. The light emitting diode as claimed in claim 1 further comprising a metal casing inside which a slot is defined and exposed through an open side of the casing, at least one light emitting diode is received and retained in the slot with the light-focusing port exposed through the open side of the casing, a circuit board being arranged inside the casing and electrically connected to the terminals of the light emitting diode, the casing being helpful in removing heat generated by the light emitting diode.

10. The light emitting diode as claimed in claim 9, wherein the metal that makes the casing is selected from a group consisting of aluminum, copper and iron

11. The light emitting diode as claimed in claim 9, wherein the casing comprises an aluminum-extruded member