Sensor semiconductor package, provided with an insert, and method for making same
First Claim
1. A method of fabricating a semiconductor package, characterized in that it consists:
- in placing, in an injection cavity (18) of an injection mold (21), a semiconductor component (5), a rear face of which is attached to a front face of mounting and electrical connection means (2) and a front face of which comprises a sensor (8), and an insert (11) that includes an open passage (14) lying in front of said sensor and provided with a plug (17) closing said passage and that has an end (13) bearing on the front face of said component, around said sensor, and a front face (22) bearing against a bottom (24) of said cavity, and in injecting an encapsulation material (26) into said cavity so as to encapsulate said mounting and electrical connection means and, peripherally, said semiconductor component and said insert.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.
20 Citations
14 Claims
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1. A method of fabricating a semiconductor package, characterized in that it consists:
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in placing, in an injection cavity (18) of an injection mold (21), a semiconductor component (5), a rear face of which is attached to a front face of mounting and electrical connection means (2) and a front face of which comprises a sensor (8), and an insert (11) that includes an open passage (14) lying in front of said sensor and provided with a plug (17) closing said passage and that has an end (13) bearing on the front face of said component, around said sensor, and a front face (22) bearing against a bottom (24) of said cavity, and in injecting an encapsulation material (26) into said cavity so as to encapsulate said mounting and electrical connection means and, peripherally, said semiconductor component and said insert. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification