Manufacturing method for a wireless communication device and manufacturing apparatus

• US 20040078957A1
• Filed: 04/24/2003
• Published: 04/29/2004
• Est. Priority Date: 04/24/2002
• Status: Active Grant

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: Forster, Ian J., King, Patrick F.
• Granted Patent: US 7,191,507 B2
• Time in Patent Office: Days
• US Class Current: 29/601
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Claims

1. A method of producing a wireless communication device, comprising:

adjustably cutting a first tab for use as a first antenna element;

adjustably cutting a second tab for use as a second antenna element; and

securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device.

2. The method of claim 1, further comprising creating a cavity in a substrate.

3. The method of claim 2, further comprising inserting said wireless communication chip into said cavity such that said wireless communication chip is flush with an upper level of said substrate.

4. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises adhering with a conductive adhesive said first and second tabs to the wireless communication chip.

5. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises welding said first and second tabs to the wireless communication chip.

6. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip, further comprises:

creating fingers on said first and second tabs;

heating pins on the wireless communication chip; and

inserting said heated pins into a substrate such that the fingers on said first and second tabs wrap around said pins and a mechanical bond is formed around said pins.

7. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises soldering the wireless communication chip to the first and second tabs.

8. The method of claim 7, wherein soldering the wireless communication chip to the first and second tabs comprises applying a soldering paste to said first and second tabs.

9. The method of claim 8, wherein soldering the wireless communication chip to the first and second tabs further comprises using infrared radiation to heat the soldering paste.

10. The wireless communication device formed according to the method of claim 1.

11. The method of claim 1, wherein adjustably cutting a first tab for use as a first antenna element comprises using a plurality of selectively phaseable rollers to cut said first tab.

12. The method of claim 1, wherein adjustably cutting a first tab for use as a first antenna element comprises varying a position associated with a cutting roller with respect to a center point so as to increase or decrease the length of the tab.

13. The method of claim 1, wherein adjustably cutting a second tab for use as a second antenna element comprises using a plurality of selectively phaseable rollers to cut said second tab.

14. A method of producing a wireless communication device, comprising:

passing a conductive foil having a backing material through a first roller to generate a first cut;

passing the metal foil having a backing material through a second roller to generate a second cut thereby forming a first antenna element; and

passing the conductive foil having a backing material through a third roller to generate a third cut thereby forming a second antenna element.

15. The method of claim 14, further comprising separating waste material from said backing material.

16. The method of claim 14, further comprising varying the relative phases of the rollers to vary the size of the first and second antenna elements.

17. The method of claim 14, wherein varying the relative phases of the rollers comprises varying the phase of the second roller with respect to the first roller to vary the size of the first antenna element.

18. The method of claim 14, wherein the cut formed by the second roller overlaps the cut formed by the first roller.

19. The method of claim 14, wherein the cut formed by the third roller overlaps the cut formed by the first roller.

20. The method of claim 14, wherein the cut formed by the first roller comprises portions of cuts required to form the first and second antenna element.

21. A method of forming a wireless communication device comprising:

passing a tape comprising a plurality of tabs disposed thereon under a first roller and a second roller;

testing capacitance formed by said tabs;

varying the spacing between the first and second rollers; and

cutting two of the tabs to form antenna elements for the wireless communication device.

22. The method of claim 21, wherein at least two of said tabs are differently sized.

23. The method of claim 21, wherein cutting two of the tabs to form antenna elements comprises cutting a backing material as well.

24. The method of claim 23, further comprising adhering said backing material to a substrate.

25. The method of claim 21, further comprising positioning said tape proximate a substrate prior to the step of testing capacitance.

26. An apparatus for producing wireless communication devices, comprising:

a plurality of rollers adapted to receive a production line;

means for cutting antenna elements from the production line; and

means for securing a wireless communication chip to said antenna elements and a substrate to form the wireless communication device.

27. The apparatus of claim 26 wherein said plurality of rollers comprises two independently positionable rollers.

28. The apparatus of claim 27 wherein said two independently positionable rollers are adapted to receive a production line comprising a backing material having antenna elements and a wireless communication chip disposed thereon.

29. The apparatus of claim 28 wherein said means for cutting antenna elements from the production line comprises means to cut a hole through said backing, around the chip and through the antenna elements.

30. The apparatus of claim 29 further comprising a radiator that assesses the capacitance of the antenna elements prior to cutting to determine an appropriate size for the cut made by the cutting means.

31. The apparatus of claim 26 wherein said plurality of rollers comprises three rollers each making a cut on the production line.

32. The apparatus of claim 31 wherein a first of the three rollers makes a cut that comprises an interior portion of a pair of antenna elements.

33. The apparatus of claim 32 wherein a second of the three rollers makes a cut that comprises an exterior portion of one of the pair of antenna elements.

34. The apparatus of claim 33 wherein a third of the three rollers makes a cut that comprises an exterior potion of the other of the pair of antenna elements.

35. The apparatus of claim 34 wherein said three rollers are phased so as to vary selectively the size of the antenna elements.

36. The apparatus of claim 26 wherein said means for securing a wireless communication chip to said antenna elements and a substrate to form the wireless communication device comprises an adhesive.

37. The apparatus of claim 26 wherein said means for securing a wireless communication chip to said antenna elements and a substrate to form the wireless communication device comprises a hot gas jet to heat pins of the wireless communication chip prior to insertion between fingers cut into the antenna elements and the substrate.

38. A method of preparing wireless communication chips for later processing, comprising:

positioning a wireless communication chip in a container in carrier tape;

stripping a protective adhesive from the carrier tape;

passing the carrier tape over a roller; and

forcing the wireless communication chip into contact with an adhesive tape for later processing.

39. The method of claim 38 wherein said later processing comprises joining said wireless communication chip to an antenna element to form a wireless communication device.

40. The method of claim 39 wherein joining said wireless communication chip to an antenna element to form a wireless communication device comprises passing a substrate having the antenna element and the adhesive tape between two heated rollers to secure the wireless communication chip to the antenna element.

41. A method of preparing an antenna for use on a wireless communication device, comprising:

passing a metal foil on an adhesive backing through a pair of rollers, one of said pair being a die cut roller;

die-cutting the metal foil with the die cut roller into a pair of antenna tabs;

removing unused foil from the adhesive backing; and

passing the adhesive backing with the antenna tabs positioned thereon downstream for securement to a substrate.

42. The method of claim 41 wherein said metal foil is a copper foil.

43. The method of claim 41 wherein said metal foil is an aluminum foil.

44. The method of claim 41 further comprising positioning said die cut roller such that said die cut roller is spaced from the adhesive backing by said metal foil.

45. A method of preparing an antenna for use on a wireless communication device, comprising:

passing a metal foil through a pair of rollers, one of said pair being a die cut roller;

die-cutting the metal foil with the die cut roller into a pair of antenna tabs; and

passing the antenna tabs downstream for securement to a substrate.