High-accuracy placement method utilizing double pick and place

• US 20040084507A1
• Filed: 11/05/2002
• Published: 05/06/2004
• Est. Priority Date: 11/05/2002
• Status: Active Grant

• Current Assignee: Palomar Technologies Incorporated
• Original Assignee: Palomar Technologies Incorporated
• Inventors: Brajkovich, John, Bok, Zeger, Smith, Jay L. II
• Granted Patent: US 6,776,327 B2
• Time in Patent Office: Days
• US Class Current: 228/123.1
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 37/047 moving work to adjust its position between soldering, welding or cutting steps B23K37/053 takes precedence

Abstract

A method is provided for placement of a first workpiece onto a second workpiece. The first workpiece is initially positioned at an origination location and the second workpiece has an attach location different from the origination location. A first place step is performed to displace the first workpiece from the origination location to an intermediate location different from the origination and attach locations. A second place step is performed to displace the first workpiece from the intermediate location to the attach location and the first workpiece is attached to the second workpiece at the attach location.

Claims

1. A method for placement of a first workpiece onto a second workpiece comprising the steps of:

a) providing a first workpiece positioned at an origination location different from a target intermediate location;

b) providing a second workpiece positioned at a work location and having a target attach location different from said target intermediate location and said origination location;

c) performing a first place step to displace said first workpiece from said origination location to an actual intermediate location, wherein said actual intermediate location is different from said origination location and is identical to said target intermediate location or differs from said target intermediate location by an intermediate error deviation; and

d) performing a second place step to displace said first workpiece from said actual intermediate location to an actual attach location on said second workpiece, wherein said actual attach location is different from said origination location and said target intermediate location and is identical to said target attach location or differs from said target attach location by an attach error deviation.

2. The method of claim 1 further comprising attaching said first workpiece to said actual attach location.

3. The method of claim 1 wherein said first workpiece is displaced from said actual intermediate location to said actual attach location with reference to a second place path determined by referencing said target attach location.

4. The method of claim 1 wherein said first workpiece is displaced from said origination location to said actual intermediate location with reference to a first place path determined by referencing said target intermediate location.

5. The method of claim 1 further comprising performing a first pick step, in advance of said first place step wherein a pickup tool engages said first workpiece at said origination location.

6. The method of claim 5 wherein said first workpiece is displaced in said first place step by displacement of said pickup tool engaging said first workpiece.

7. The method of claim 5 further comprising disengaging said pickup tool from said first workpiece at said actual intermediate location.

8. The method of claim 1 further comprising performing a second pick step, in advance of said second place step wherein a pickup tool engages said first workpiece at said actual intermediate location.

9. The method of claim 8 wherein said first workpiece is displaced in said second place step by displacement of said pickup tool engaging said first workpiece.

10. The method of claim 5 wherein said first workpiece is displaced in said second place step by displacement of said pickup tool engaging said first workpiece.

11. The method of claim 1 wherein said attach error deviation is between about 0 and 2 degrees with respect to a rotational reference axis or between about 0 and 10 microns with respect to linear reference axes.

12. The method of claim 1 wherein said intermediate error deviation is between about 0 and 5 degrees with respect to a rotational reference axis or between about 0 and 15 microns with respect to linear reference axes.

13. The method of claim 1 wherein said intermediate error deviation is greater than said attach error deviation.

14. The placement method of claim 2 wherein said first workpiece is thermally attached to said actual attach location by heating said first or second workpiece or both first and second workpieces to a thermal attachment temperature sufficient to effect thermal attachment of said first workpiece to said actual attach location.

15. The placement method of claim 14 wherein said first workpiece is preheated before said second place step to a background temperature less than said thermal attachment temperature.

16. The placement method of claim 2 wherein said first workpiece is attached to said actual attach site location by soldering.

17. The placement method of claim 1 wherein said first workpiece is a die.

18. The placement method of claim 1 wherein said second workpiece is a circuit body.

19. The method of claim 1 wherein said first workpiece is a first pair first workpiece of a first workpiece pair, said origination location is a first pair origination location, said second workpiece is a first pair second workpiece of said first workpiece pair, and said target attach location is a first pair target attach location, said placement method further comprising:

displacing said first pair second workpiece from said work location;

providing a second workpiece pair consisting of a second pair first workpiece and a second pair second workpiece, wherein said second pair first workpiece is positioned at a second pair origination location different from said target intermediate location and said first pair origination location and said second pair second workpiece has a second pair target attach location;

positioning said second pair second workpiece at said work location such that said second pair target attach location corresponds identically to said first pair target attach location when said first pair second workpiece was positioned at said work location;

performing a second pair first place step to displace said second pair first workpiece from said second pair origination location to a second pair actual intermediate location, wherein said second pair actual intermediate location is different from said second pair origination location and is identical to said target intermediate location or differs from said target intermediate location by a second pair intermediate error deviation; and

performing a second pair second place step to displace said second pair first workpiece from said second pair actual intermediate location to a second pair actual attach location on said second pair second workpiece, wherein said second pair actual attach location is different from said second pair origination location and said target intermediate location and is identical to said second pair target attach location or differs from said second pair target attach location by a second pair attach error deviation.

20. The method of claim 19 further comprising attaching said second pair first workpiece to said second pair actual attach location.

21. The method of claim 19 wherein said first and second pair origination locations are on a carrier.

22. The method of claim 1 wherein said first workpiece is a first pair first workpiece of a first workpiece pair, said origination location is a first pair origination location, said second workpiece is said second workpiece of said first workpiece pair, and said target attach location is a first pair target attach location, said placement method further comprising:

providing a second workpiece pair consisting of a second pair first workpiece and said second workpiece, wherein said second pair first workpiece is positioned at a second pair origination location different from said target intermediate location and said first pair origination location and said second workpiece has a second pair target attach location different from said first pair target attach location;

performing a second pair first place step to displace said second pair first workpiece from said second pair origination location to a second pair actual intermediate location, wherein said second pair actual intermediate location is different from said second pair origination location and is identical to said target intermediate location or differs from said target intermediate location by a second pair intermediate error deviation; and

performing a second pair second place step to displace said second pair first workpiece from said second pair actual intermediate location to a second pair actual attach location on said second workpiece, wherein said second pair actual attach location is different from said second pair origination location, said target intermediate location, and said first pair target and actual attach locations and is identical to said second pair target attach location or differs from said second pair target attach location by a second pair attach error deviation.

23. The method of claim 22 further comprising attaching said second pair first workpiece to said second pair actual attach location.

24. A method for placement of a first workpiece onto a second workpiece comprising the steps of:

a) providing a first workpiece positioned at an origination location different from a target intermediate location;

b) providing a second workpiece having a target attach location different from said origination location;

c) performing a first place step to displace said first workpiece from said origination location to an actual intermediate location, wherein said actual intermediate location is identical to said target intermediate location or differs from said target intermediate location by an intermediate error deviation; and

d) performing a second place step to displace said first workpiece from said actual intermediate location to an actual attach location, wherein said actual attach location is identical to said target attach location or differs from said target attach location by an attach error deviation.

25. The method of claim 24 wherein said target attach location is identical to said target intermediate location.

26. The method of claim 25 further comprising attaching said first workpiece to said actual attach location.

27. The method of claim 25 wherein said first workpiece is displaced from said actual intermediate location to said actual attach location with reference to a second place path determined by referencing said target attach location.

28. The method of claim 25 wherein said first workpiece is displaced from said origination location to said actual intermediate location with reference to a first place path determined by referencing said target intermediate location.

29. The method of claim 25 further comprising performing a first pick step, in advance of said first place step wherein a pickup tool engages said first workpiece at said origination location.

30. The method of claim 29 wherein said first workpiece is displaced in said first place step by displacement of said pickup tool engaging said first workpiece.

31. The method of claim 29 further comprising disengaging said pickup tool from said first workpiece at said actual intermediate location.

32. The method of claim 25 further comprising performing a second pick step, in advance of said second place step wherein a pickup tool engages said first workpiece at said actual intermediate location.

33. The method of claim 32 wherein said first workpiece is displaced in said second place step by displacement of said pickup tool engaging said first workpiece.

34. The method of claim 29 wherein said first workpiece is displaced in said second place step by displacement of said pickup tool engaging said first workpiece.

35. The method of claim 25 wherein said attach error deviation is between about 0 and 2 degrees with respect to a rotational reference axis or between about 0 and 10 microns with respect to linear reference axes.

36. The method of claim 25 wherein said intermediate error deviation is between about 0 and 5 degrees with respect to a rotational reference axis or between about 0 and 15 microns with respect to linear reference axes.

37. The method of claim 25 wherein said intermediate error deviation is greater than said attach error deviation.

38. The placement method of claim 27 wherein said first workpiece is thermally attached to said actual attach location by heating said first or second workpiece or both first and second workpieces to a thermal attachment temperature sufficient to effect thermal attachment of said first workpiece to said actual attach location.

39. The placement method of claim 38 wherein said first workpiece is preheated before said second place step to a background temperature less than said thermal attachment temperature.

40. The placement method of claim 27 wherein said first workpiece is attached to said actual attach site location by soldering.

41. The placement method of claim 25 wherein said first workpiece is a die.

42. The placement method of claim 25 wherein said second workpiece is a circuit body.

43. The method of claim 25 wherein said first workpiece is a first pair first workpiece of a first workpiece pair, said origination location is a first pair origination location, said second workpiece is a first pair second workpiece of said first workpiece pair, and said target attach location is a first pair target attach location, said placement method further comprising:

displacing said first pair second workpiece from said work location;

providing a second workpiece pair consisting of a second pair first workpiece and a second pair second workpiece, wherein said second pair first workpiece is positioned at a second pair origination location different from said target intermediate location and said first pair origination location and said second pair second workpiece has a second pair target attach location;

positioning said second pair second workpiece at said work location such that said second pair target attach location corresponds identically to said first pair target attach location and said target intermediate location when said first pair second workpiece was positioned at said work location;

performing a second pair first place step to displace said second pair first workpiece from said second pair origination location to a second pair actual intermediate location, wherein said second pair actual intermediate location is different from said second pair origination location and is identical to said target intermediate location or differs from said target intermediate location by a second pair intermediate error deviation; and

performing a second pair second place step to displace said second pair first workpiece from said second pair actual intermediate location to a second pair actual attach location on said second pair second workpiece, wherein said second pair actual attach location is different from said second pair origination location and said target intermediate location and is identical to said second pair target attach location or differs from said second pair target attach location by a second pair attach error deviation.

44. The method of claim 43 further comprising attaching said second pair first workpiece to said second pair actual attach location.

45. The method of claim 43 wherein said first and second pair origination locations are on a carrier.

46. The method of claim 25 wherein said first workpiece is a first pair first workpiece of a first workpiece pair, said origination location is a first pair origination location, said second workpiece is said second workpiece of said first workpiece pair, said target intermediate location is a first pair target intermediate location, and said target attach location is a first pair target attach location, said placement method further comprising:

providing a second workpiece pair consisting of a second pair first workpiece and said second workpiece, wherein said second pair first workpiece is positioned at a second pair origination location different from a second pair target intermediate location and said first pair origination location and said second workpiece has a second pair target attach location different from said first pair target attach location and identical to said second pair target intermediate location;

performing a second pair first place step to displace said second pair first workpiece from said second pair origination location to a second pair actual intermediate location, wherein said second pair actual intermediate location is different from said second pair origination location and is identical to said second pair target intermediate location or differs from said second pair target intermediate location by a second pair intermediate error deviation; and

performing a second pair second place step to displace said second pair first workpiece from said second pair actual intermediate location to a second pair actual attach location on said second workpiece, wherein said second pair actual attach location is different from said second pair origination location and said first pair target and actual attach locations and is identical to said second pair target attach location or differs from said second pair target attach location by a second pair attach error deviation.

47. The method of claim 46 further comprising attaching said second pair first workpiece to said second pair actual attach location

48. A method for placement of a first workpiece onto a second workpiece comprising the steps of:

a) providing a first workpiece positioned at an origination location;

b) providing a second workpiece having an attach location different from said origination location;

c) performing a first place step to displace said first workpiece from said origination location to an intermediate location different from said origination location and said attach location;

d) performing a second place step to displace said first workpiece from said intermediate location to said attach location; and

e) attaching said first workpiece to said second workpiece.