Digital CMOS sensor

• US 20040094695A1
• Filed: 11/18/2002
• Published: 05/20/2004
• Est. Priority Date: 11/18/2002
• Status: Abandoned Application

• Current Assignee: Wen Ching Chen
• Original Assignee: Wen Ching Chen
• Inventors: Chen, Wen Ching
• Application Number:
  US10/298,281
• Publication Number:
  US 20040094695A1
• Time in Patent Office: Days
• US Class Current: 250/216
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20

Abstract

A digital CMOS sensor includes a chip adapted to be electrically connected to a printed circuit board by multiple conducting wires. A transparent layer is fully enveloped the chip and the multiple wires. A convex lens is disposed on a top face of the transparent layer and aligns with the chip for guiding light rays penetrating the transparent layer to the chip.

Claims

1. A digital CMOS sensor comprising:

a chip adapted to be electrically connected to a printed circuit board by multiple conducting wires;

a transparent layer fully enveloped the chip and the multiple wires; and

a convex lens disposed on a top face of the transparent layer and aligning with the chip for guiding light rays penetrating the transparent layer to the chip.

2. The digital CMOS sensor as claimed in claim 1, wherein the convex lens is attached to the top face of the transparent layer.

3. The digital CMOS sensor as claimed in claim 1, wherein the convex lens integrally extends from the top face of the transparent layer.

4. The digital CMOS sensor as claimed in claim 2 further comprising an achromatic prism buried in the transparent layer between the lens and the chip for removing achromatic aberrations.

5. The digital CMOS sensor as claimed in claim 3 further comprising an achromatic prism buried in the transparent layer between the lens and the chip for removing achromatic aberrations.

6. The digital CMOS sensor as claimed in claim 4 further comprising a shelter covering the transparent layer to segregate the digital CMOS sensor from unnecessary light rays.

7. The digital CMOS sensor as claimed in claim 4 further comprising a frame mounted around the transparent layer to prevent the transparent layer from becoming deformed during being formed.

8. The digital CMOS sensor as claimed in claim 5 further comprising a shelter covering the transparent layer to segregate the digital CMOS sensor from unnecessary light rays.

9. The digital CMOS sensor as claimed in claim 5 further comprising a frame mounted around the transparent layer to prevent the transparent layer from becoming deformed during being formed.