Semiconductor device

• US 20040099944A1
• Filed: 10/16/2003
• Published: 05/27/2004
• Est. Priority Date: 11/21/2002
• Status: Abandoned Application

• Current Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Original Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Inventors: Kimura, Naoto
• Application Number:
  US10/687,309
• Publication Number:
  US 20040099944A1
• Time in Patent Office: Days
• US Class Current: 257/706
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

A package is formed by mounting a plurality of semiconductor chips 6 and 7 on a substrate 1, arranging a heat spreader 13 on a resin surface opposite to a surface where pads 8 for the semiconductor chips are formed, via a curved intermediate plate 11 made of a metal, and filling with resin 14. The curved intermediate plate 11 is formed so as to easily bend in order to compensate the semiconductor chips 6 and 7 for the height difference relative to the heat spreader 13, and has a plurality of bumps 12 on the surface thereof in order to allow contact with the semiconductor chips by multipoint.

Claims

1. A semiconductor device comprising:

a substrate in which an internal wire is formed;

at least one semiconductor chip mounted on the substrate;

a heat spreader which is used for externally radiating heat from the semiconductor chip; and

a heat conductive material having flexibility, which is provided between the surface opposite to surfaces of the semiconductor chip near the substrate and the undersurface of the heat spreader in accordance with the height of the space therebetween, and has a plurality of bumps at least on the semiconductor chip side surface.

2. The semiconductor device according to claim 1, further comprising resin, which is used for sealing the substrate, the semiconductor chip, the heat conductive material, and the heat spreader.

3. The semiconductor device according to claim 1, wherein the heat conductive material is a curved thin metal intermediate plate with a plurality of bumps on the upper- and the under-surface thereof, which is processed into a wave shape having a gradual curvature.

4. The semiconductor device according to claim 3, wherein the plurality of bumps of the curved intermediate plate is formed by deforming or processing the curved intermediate plate.

5. The semiconductor device according to claim 3, wherein the curved intermediate plate is made of copper as the principle component.

6. The semiconductor device according to claim 1, wherein the heat conductive material is a cylindrical metal ring with a plurality of bumps provided on a surface thereof.

7. The semiconductor device according to claim 1, wherein the heat conductive material uses a portion of the heat-spreader corresponding to a position of the semiconductor chip as a flat spring and a plurality of bumps are formed on the undersurface thereof.

8. A semiconductor device comprising:

a substrate in which an internal wire is formed;

a plurality of semiconductor chips mounted on the substrate;

a heat spreader which is used for externally radiating heat from the plurality of semiconductor chips; and

a heat conductive material having flexibility, which is provided between the surfaces opposite to surfaces of the plurality of semiconductor chips near the substrate and the undersurface of the heat spreader in accordance with the height of the space therebetween, and has a plurality of bumps at least on the semiconductor chip side surface.

9. The semiconductor device according to claim 8, further comprising resin, which is used for sealing the substrate, the plurality of semiconductor chips, the heat conductive material, and the heat spreader.

10. The semiconductor device according to claim 8, wherein the heat conductive material is a curved thin metal intermediate plate with a plurality of bumps on the upper- and the under-surface thereof, which is processed into a wave shape having a gradual curvature.

11. The semiconductor device according to claim 10, wherein the plurality of bumps of the curved intermediate plate is formed by deforming or processing the curved intermediate plate.

12. The semiconductor device according to claim 10, wherein the curved intermediate plate is made of copper as the principle component.

13. The semiconductor device according to claim 8, wherein the heat conductive material is a cylindrical metal ring with a plurality of bumps provided on a surface thereof.

14. The semiconductor device according to claim 8, wherein the heat conductive material uses a portion of the heat spreader corresponding to a position of the plurality of semiconductor chips as a flat spring and a plurality of bumps are formed on the undersurface thereof.