Testable electrostatic discharge protection circuits
First Claim
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1. A method for manufacturing a semiconductor device, comprising:
- fabricating a die comprising a device having a first bonding pad and ESD protection circuitry having a second bonding pad;
testing the device using a test system electrically connected to the first bonding pad; and
after testing, connecting the first bonding pad to the second bonding pad, wherein the ESD protection circuitry becomes functional to protect the device against electrostatic discharge after connecting the first bonding pad to the second bonding pad.
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Abstract
A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection circuitry functional to protect the MOSFET. Before connecting the bonding pads together, the ESD protection circuitry and/or the MOSFET can be separately tested. A voltage higher than functioning ESD protection circuitry would permit can be used when testing the MOSFET. A packaging process such as wire bonding or attaching the die to a substrate in a flip-chip package can connect the bonding pads after testing.
15 Citations
29 Claims
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1. A method for manufacturing a semiconductor device, comprising:
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fabricating a die comprising a device having a first bonding pad and ESD protection circuitry having a second bonding pad;
testing the device using a test system electrically connected to the first bonding pad; and
after testing, connecting the first bonding pad to the second bonding pad, wherein the ESD protection circuitry becomes functional to protect the device against electrostatic discharge after connecting the first bonding pad to the second bonding pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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16. A method for manufacturing a semiconductor device, comprising:
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fabricating a die comprising a device having a first bonding pad and ESD protection circuitry having a second bonding pad;
testing the ESD protection circuitry using a test system electrically connected to the second bonding pad; and
after testing, connecting the first bonding pad to the second bonding pad, wherein the ESD protection circuitry becomes functional to protect the device against electrostatic discharge after connecting the first bonding pad to the second bonding pad.
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17. A semiconductor device including a die that comprises:
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a transistor having a first bonding pad; and
ESD protection circuitry having a second bonding pad, wherein the ESD protection circuitry becomes functional to protect the device against electrostatic discharge only after connecting the first bonding pad to the second bonding pad. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification