Thin film depositing method and apparatus
First Claim
1. A thin film depositing method comprising the steps of:
- placing a substrate in a chamber;
causing a gas to flow into said chamber to heat said substrate through heat exchange with said gas;
evacuating said chamber; and
depositing a film on a surface of said substrate heated in said chamber.
1 Assignment
0 Petitions
Accused Products
Abstract
A thin film depositing method comprising placing a substrate in a heating chamber; allowing a first gas to flow inside the heating chamber to heat the substrate through heat exchange with the first gas; moving the substrate to a deposition chamber, evacuating the deposition chamber, and then supplying a second gas into the deposition chamber; and causing an electrical discharge in the second gas such that the second gas decomposes into decomposition components and the decomposition components adhere to a substrate surface to deposit a film thereon, wherein the first gas is a gas from which moisture and organic substances have been removed. The time required for depositing thin films is reduced thereby improving the throughput, increases in apparatus costs are suppressed, and a thin film having good properties is obtained. A thin film depositing apparatus is also provided.
17 Citations
10 Claims
-
1. A thin film depositing method comprising the steps of:
-
placing a substrate in a chamber;
causing a gas to flow into said chamber to heat said substrate through heat exchange with said gas;
evacuating said chamber; and
depositing a film on a surface of said substrate heated in said chamber.
-
-
2. A thin film depositing method comprising the steps of:
-
placing a substrate in a heating chamber;
causing a first gas to flow into said heating chamber to heat said substrate through heat exchange with said first gas;
moving said substrate to a deposition chamber, evacuating said deposition chamber, and then supplying a second gas into said deposition chamber; and
causing an electrical discharge in said second gas such that said second gas decomposes into components which adhere to a surface of said substrate to deposit a film thereon, wherein said first gas is a gas from which moisture and organic substances have been removed. - View Dependent Claims (3, 4)
-
-
5. A thin film depositing apparatus comprising:
-
a chamber;
a substrate placed in said chamber;
a gas which flows inside said chamber to heat said substrate through heat exchange with said gas; and
a pumping system which evacuates said chamber;
whereby a film is deposited on a surface of said substrate in said chamber.
-
-
6. A thin film depositing apparatus comprising:
-
a heating chamber;
a substrate placed in said heating chamber;
a gas which flows inside said heating chamber to heat said substrate through heat exchange with said gas; and
a deposition chamber in which a film is deposited on a surface of said substrate, said deposition chamber being located downstream of and connected to said heating chamber through a valve, wherein said gas is a gas from which moisture and organic substances have been removed. - View Dependent Claims (7, 8, 9, 10)
-
Specification