Placement tool for wafer scale caps
First Claim
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1. A tool used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer, the tool comprising:
- a first tool half made from a semiconductor that has a coefficient of thermal expansion which is about the same as that of the wafer;
the first tool half having surface features for molding and retaining the array;
the caps having central areas surrounded by sidewalls.
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Abstract
A tool is used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer. The tool comprises a first tool half made from a semiconductor which has a coefficient of thermal expansion which is about the same as that of the wafer. The first tool half has surface features for molding and retaining the array. The caps have central areas surrounded by sidewalls.
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Citations
20 Claims
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1. A tool used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer, the tool comprising:
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a first tool half made from a semiconductor that has a coefficient of thermal expansion which is about the same as that of the wafer;
the first tool half having surface features for molding and retaining the array;
the caps having central areas surrounded by sidewalls. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification