Flanged terminal pins for dc/dc converters

• US 20040137803A1
• Filed: 11/25/2003
• Published: 07/15/2004
• Est. Priority Date: 12/20/1999
• Status: Active Grant

• Current Assignee: SynQor Incorporated
• Original Assignee: SynQor Incorporated
• Inventors: Pitzele, Lennart
• Granted Patent: US 6,896,526 B2
• Time in Patent Office: Days
• US Class Current: 439/884
• CPC Class Codes: H01R 12/58 terminals for insertion into holes
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/1081 Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
• CPC Class Codes: H05K 2201/10871 Leads having an integral insert stop
• CPC Class Codes: H05K 2203/0545 Pattern for applying drops or paste; Applying a pattern made of drops or paste using thick film techniques to apply conductive material by using a substrate with a shape pattern H05K3/1258
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 7/142 Spacers not being card guides
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Claims

1. A terminal pin comprising:

an elongated pin for insertion into a hole of a printed circuit board; and

a flange having a shoulder to abut the printed circuit board into which the pin is inserted, the flange being chamfered to provide a vent to the hole of the printed circuit board.

2. A terminal pin as claimed in claim 1 comprising two opposed chamfers.

3. A terminal pin as claimed in claim 2 wherein edges of the two opposed chamfers are at about the periphery of the pin.

4. A circuit module comprising:

a circuit substrate having circuitry thereon; and

at least one rigid terminal pin attached to the circuit substrate, the terminal pin including a flange having a shoulder to abut a printed circuit board into which the pin is inserted, the flange being chamfered to provide a vent to a hole of the printed circuit board into which the pin is inserted.

5. A module as claimed in claim 4 comprising two opposed chamfers.

6. A module as claimed in claim 5 wherein edges of the two opposed chamfers are at about the periphery of the pin.

7. A module as claimed in claim 4 wherein the pin is electrically connected to the circuitry.

8. A circuit board assembly comprising:

a printed circuit board;

a circuit module having circuitry thereon; and

at least one rigid terminal pin attached to the circuit module, the terminal pin including a flange having a shoulder to abut the printed circuit board, the flange being chamfered to provide a vent to a hole of the printed circuit board into which the pin is inserted.

9. A circuit board assembly as claimed in claim 8 comprising two opposed chamfers.

10. A circuit board assembly as claimed in claim 9 wherein edges of the two opposed chamfers are at about the periphery of the pin.

11. A circuit board assembly as claimed in claim 8 wherein the pin is electrically connected to the circuitry.

12. A method of soldering a circuit module to a printed circuit board comprising:

providing at least one rigid terminal pin on the circuit module, the terminal pin including a flange having a shoulder to abut a hole in a printed circuit board into which the pin is inserted, the flange having a chamfer facing the printed circuit board;

positioning the module on the printed circuit board with the pin inserted into a hole in the printed circuit board and the flange shoulder abutting the printed circuit board, the chamfer providing a vent to the hole; and

causing solder to flow through an opening between the chamfer and printed circuit board.

13. A method as claimed in claim 12 wherein the solder is applied in a wave soldering process.

14. A method as claimed in claim 12 wherein the solder is applied in a reflow soldering process.

15. A method as claimed in claim 12 comprising two opposed chamfers.

16. A method as claimed in claim 15 wherein edges of the two opposed chamfers are at about the periphery of the pin.