Electronic parts mounting apparatus and electronic parts mounting method

• US 20040139602A1
• Filed: 01/09/2004
• Published: 07/22/2004
• Est. Priority Date: 01/15/2003
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Saho, Hidehiro
• Granted Patent: US 8,091,216 B2
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H05K 13/041 having multiple pick-up tools
• CPC Class Codes: H05K 13/0411 having multiple mounting heads
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

In an electronic parts mounting apparatus provided with rotary type multi-nozzle type mounting heads 10A, 10B in each of which a plurality of suction nozzles 20 are disposed in a radial manner on a rotor mechanism 18 which rotates around a rotation shaft 18a, a parts mount mechanism 8 is configured in a manner that the axial direction of the rotation shaft 18a is made coincide with the arrangement direction of tape feeders 5 in a parts supply portion 4 and a shaft-to-shaft distance D of the suction nozzles 20 is set to be plural times as large as the pitch p of the feeder arrangement. Thus, in a pick-up process, a plurality of electronic parts can be simultaneously picked up from the tape feeders 5. In a parts mounting process, while one of the mounting heads performs the part mounting operation, the other mounting head can complete a nozzle change-over operation in a manner that the suction nozzle holding an electronic part to be mounted next is moved to a operation position.

Claims

1. An electronic parts mounting apparatus which takes out electronic parts from a parts supply portion, then transfers and mounts the parts on a board, the electronic parts mounting apparatus comprising:

a board positioning portion for positioning the board transferred in a first direction;

parts feeders arranged with a predetermined pitch-along the first direction at the parts supply portion;

a plurality of mounting heads in each of which a plurality of suction nozzles, each revolving around a horizontal rotation shaft set so as to be aligned with the first direction and being capable of sucking and holding the electronic part, are disposed in a radial manner around the rotation shaft; and

head moving means for integrally moving a plurality of the mounting heads between the parts supply portion and the board positioning portion.

2. An electronic parts mounting apparatus according to claim 1, wherein a plurality of the mounting heads are disposed in parallel from one another along the first direction.

3. An electronic parts mounting apparatus according to claim 2, wherein a distance between the adjacent mounting heads is set in a manner that a shaft-to-shaft distance between the suction nozzles provided at the respective mounting heads is plural times as large as an arrangement pitch of the parts feeders of the parts supply portion.

4. An electronic parts mounting apparatus according to claim 2, wherein each of a plurality of the mounting heads is provided with a parts recognition camera for recognizing the electronic parts.

5. An electronic parts mounting method for transferring and mounting electronic parts on a board by using an electronic parts mounting apparatus which comprising:

a board positioning portion for positioning the board transferred in a first direction;

parts feeders arranged with a predetermined pitch along the first direction at the parts supply portion;

a plurality of mounting heads in each of which a plurality of suction nozzles, each revolving around a horizontal rotation shaft set so as to be aligned with the first direction and being capable of sucking and holding the electronic part, are disposed in a radial manner around the rotation shaft; and

head moving means for integrally moving a plurality of the mounting heads between the parts supply portion and the board positioning portion, the electronic parts mounting method comprising;

a pick-up step for moving a plurality of the mounting heads to the parts supply portion and taking out electronic parts from the parts feeders by using the suction nozzles of the mounting heads;

a head moving step for moving a plurality of the mounting heads holding the electronic parts to the board positioning portion; and

a parts mounting step for sequentially mounting the electronic parts held by the respective suction nozzles on mounting points of the board by a plurality of the mounting heads, respectively,

wherein in the parts mounting step, while the suction nozzle in one of the mounting heads is moved up and down with respect to the board to mount an electronic part held by the suction nozzle on the board, the suction nozzle holding an electronic part to be mounted next in another of the mounting heads is revolved around the rotation shaft.

6. An electronic parts mounting method according to claim 5, wherein in the pick-up step, electronic parts are simultaneously picked up by a plurality of the mounting heads from a plurality of the parts feeders.

7. An electronic parts mounting method according to claim 5, wherein the electronic parts held by a plurality of the mounting heads are recognized by parts recognition cameras respectively provided at a plurality of the mounting heads.