Polymer-embedded solder bumps for reliable plastic package attachment

  • US 20040149479A1
  • Filed: 01/20/2004
  • Published: 08/05/2004
  • Est. Priority Date: 08/08/2002
  • Status: Abandoned Application
First Claim
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1. A plastic package for use in semiconductor devices, said package having a plurality of metallic terminals exposed on a package surface, comprising:

  • a metallic bump attached to each of said terminals, said bumps made of reflowable metal and having approximately uniform height; and

    an adherent layer of polymer material covering said package surface and surrounding each of said bumps to form a solid meniscus, said layer having a thickness between a quarter and one half of said bump height.

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