Method of forming an electronic device

• US 20040151014A1
• Filed: 01/20/2004
• Published: 08/05/2004
• Est. Priority Date: 10/14/1997
• Status: Active Grant

• Current Assignee: Stuart Philip Speakman
• Original Assignee: Stuart Philip Speakman
• Inventors: Speakman, Stuart Philip
• Granted Patent: US 7,129,166 B2
• Time in Patent Office: Days
• US Class Current: 365/49
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 40/00 Auxiliary operations or equipment, e.g. for material handling
• CPC Class Codes: B33Y 40/10 Pre-treatment
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: B41J 2/01 Ink jet
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 3/407 for marking on special material
• CPC Class Codes: B41J 3/4073 Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects B41J3/283, B41J3/286 take precedence; building up a 3D object using individual droplets from jetting heads B29C64/112
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0565 Polymeric materials, e.g. gel-type or solid-type
• CPC Class Codes: H01M 6/188 Processes of manufacture
• CPC Class Codes: H01M 6/40 Printed batteries , e.g. thin film batteries
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/125 by ink-jet printing
• CPC Class Codes: H10K 10/20 Organic diodes
• CPC Class Codes: H10K 10/46 Field-effect transistors, e.g. organic thin-film transistors [OTFT] H10K10/43 takes precedence
• CPC Class Codes: H10K 2102/103 comprising indium oxides, e.g. ITO
• CPC Class Codes: H10K 30/00 : Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation integrated devices or assemblies of multiple devices H10K39/00, H10K65/00; electrolytic light-sensitive devices H01G9/20
• CPC Class Codes: H10K 30/10 : comprising heterojunctions between organic semiconductors and inorganic semiconductors
• CPC Class Codes: H10K 30/20 : comprising organic-organic junctions, e.g. donor-acceptor junctions
• CPC Class Codes: H10K 30/30 : comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
• CPC Class Codes: H10K 50/11 : characterised by the electroluminescent [EL] layers
• CPC Class Codes: H10K 50/85 : Arrangements for extracting light from the devices
• CPC Class Codes: H10K 59/00 : Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
• CPC Class Codes: H10K 71/13 : using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/135 : using ink-jet printing
• CPC Class Codes: H10K 71/40 : Thermal treatment, e.g. annealing in the presence of a solvent vapour
• CPC Class Codes: H10N 10/01 : Manufacture or treatment
• CPC Class Codes: Y02E 10/549 : Organic PV cells
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A method of forming an electronic circuit component using the technique of drop on demand printing to deposit droplets of deposition material, said method comprising depositing a plurality of droplets on a surface to form a patterned electronic device comprising multiple discrete portions.

Claims

1. An electrical component formed on a surface, comprising a layer of droplets of deposition material provided by droplet ejection, on the surface, and at least one second deposited droplet deposited by droplet ejection on said layer.