Membrane probing system

• US 20040154155A1
• Filed: 02/03/2004
• Published: 08/12/2004
• Est. Priority Date: 07/14/1998
• Status: Active Grant

• Current Assignee: FormFactor Beaverton, Inc. (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Smith, Kenneth, Koxxy, Martin, Gleason, Reed, Bayne, Michael A., Lesher, Timothy
• Granted Patent: US 7,400,155 B2
• Time in Patent Office: Days
• US Class Current: 29/428
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 13/2464 characterized by the contact point
• CPC Class Codes: H01R 43/16 for manufacturing contact members, e.g. by punching and by bending
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 : by assembling plural parts
• CPC Class Codes: Y10T 29/49218 : with deforming
• CPC Class Codes: Y10T 29/49815 : Disassembling
• CPC Class Codes: Y10T 29/49824 : to elastically deform work part or connector
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/53509 : Means to assemble tire stud into tire tread

Abstract

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Claims

1. A method of constructing a membrane probe comprising:

(a) providing a substrate;

(b) creating a depression within said substrate;

(c) locating conductive material within said depression;

(d) connecting a conductive trace to said conductive material; and

(e) removing said substrate from said conductive material.