Ic card

• US 20040169086A1
• Filed: 12/05/2003
• Published: 09/02/2004
• Est. Priority Date: 06/07/2001
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Ohta, Eiji, Ishii, Osamu
• Granted Patent: US 7,131,594 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/06046 Constructional details
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 2019/06281 rewritable
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers

Abstract

An IC card having high reliability, which is not only in that printing can be surely conducted with respect to the reversible display layer provided on the surface of the card substrate, but also in that the IC chip is surely protected by the reinforcing sheet. An IC card which has: an IC module (1) including an IC chip (14) mounted on an insulating substrate (11), and a reinforcing sheet (16) provided over the IC chip (14) through a sealing resin (15) for sealing the IC chip (14); a card substrate (2) comprised of a resin for sealing the IC module (1); and a reversible recording layer (3) provided on at least one surface of the card substrate (2), wherein reinforcing film patterns (13), (13′) having openings (13a), (13a′) which expose the IC chip (14) mounted portion are provided on at least one of the IC chip (14) mounted surface and the non-mounted surface of the insulating substrate (11).

Claims

1. An IC card comprising:

an IC module which comprises an IC chip mounted on an insulating substrate, and a reinforcing sheet provided over said IC chip through a sealing resin for sealing said IC chip;

a card substrate comprised of a resin for sealing said IC module; and

a reversible display layer provided on at least one surface of said card substrate,

said IC card being characterized in that a reinforcing film pattern having an opening which exposes an IC chip mounted portion is provided on at least one of an IC chip mounted surface and a non-mounted surface of said insulating substrate.

2. The IC card according to claim 1, characterized in that a periphery of said opening in said reinforcing film pattern is located on the IC chip side than on an outer periphery of said reinforcing sheet.

3. The IC card according to claim 1, characterized in that at least part of an outer periphery of said reinforcing film pattern is located outside an outer periphery of said reinforcing sheet.

4. The IC card according to claim 1, characterized in that said insulating substrate has a reinforcing sheet provided on said non-mounted surface through an adhesive at a position corresponding to said IC chip mounted portion.

5. The IC card according to claim 1, characterized in that said insulating substrate has a circuit pattern formed on said mounted surface, wherein said reinforcing film pattern provided on said mounted surface is comprised of the same material as that for said circuit pattern.

6. The IC card according to claim 1, characterized in that said insulating substrate has a circuit pattern formed on said IC chip mounted surface, wherein said reinforcing film pattern provided on said non-mounted surface of said insulating substrate is comprised of a conductive material and has a form such that no portion is overlapped on said circuit pattern.

7. The IC card according to claim 1, characterized in that said insulating substrate has a circuit pattern formed on said IC chip mounted surface, wherein said reinforcing film pattern provided on said non-mounted surface of said insulating substrate is comprised of a conductive material and divided into a plurality of portions per portion to be overlapped on said circuit pattern.

8. The IC card according to claim 1, characterized in that said reinforcing film pattern is comprised of an insulating material.