Light emitting diode and light emitting diode array
First Claim
Patent Images
1. A light emitting diode, comprising:
- a ceramics substrate that has a high thermal conductivity;
a light emitting element that is mounted on the ceramics substrate; and
a radiation plate that is bonded to the back surface of the ceramics substrate;
wherein the radiation plate contacts the ceramics substrate at a contact region that includes a region of the back surface of the ceramics substrate corresponding to a region of the ceramics substrate on which the light emitting element is mounted.
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Abstract
A light emitting diode has: a ceramics substrate that has a high thermal conductivity; a light emitting element that is mounted on the ceramics substrate; and a radiation plate that is bonded to the back surface of the ceramics substrate. The radiation plate contacts the ceramics substrate at a contact region that includes a region of the back surface of the ceramics substrate corresponding to a region of the ceramics substrate on which the light emitting element is mounted.
81 Citations
17 Claims
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1. A light emitting diode, comprising:
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a ceramics substrate that has a high thermal conductivity;
a light emitting element that is mounted on the ceramics substrate; and
a radiation plate that is bonded to the back surface of the ceramics substrate;
wherein the radiation plate contacts the ceramics substrate at a contact region that includes a region of the back surface of the ceramics substrate corresponding to a region of the ceramics substrate on which the light emitting element is mounted. - View Dependent Claims (2, 3, 4, 5)
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6. A light emitting diode array, comprising:
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a ceramics substrate that has a high thermal conductivity;
a light emitting element that is mounted on the ceramics substrate; and
a radiation plate that is bonded to the back surface of the ceramics substrate;
wherein the radiation plate contacts the ceramics substrate at a contact region that includes a region of the back surface of the ceramics substrate corresponding to a region of the ceramics substrate on which the light emitting element is mounted; and
a circuit board on which the plurality of light emitting diodes are mounted, the circuit board including a through-hole.
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7. A light emitting diode, comprising:
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a circuit board that includes a plurality of penetrating holes, each of which having a narrowed portion;
a ceramics substrate that is mounted on the circuit board while bridging the narrowed portion, the ceramics substrate having a high thermal conductivity;
a light emitting element that is mounted on a circuit pattern of the ceramics substrate; and
a radiation plate that is bonded to the back surface of the ceramics substrate and extends in one of the plurality of penetrating holes without contacting the edge of the one of the plurality of penetrating holes and;
wherein the circuit pattern of the ceramics substrate is electrically connected to a circuit pattern of the circuit board at the bridged narrowed portion. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A light emitting diode, comprising:
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a substrate that has a low coefficient of thermal expansion and a high thermal resistance;
a circuit pattern that is formed using a conductive material on the substrate;
a light emitting element that is mounted on the surface of the substrate;
a metal member that electrically connects the light emitting element to the circuit pattern;
a glass lens that covers the periphery of the light emitting element while leaving a space and a resin injection hole, the space being defined to house the light emitting element and the metal member;
a sealing material that seals the surface of the substrate and the glass lens; and
light transmitting resin that is filled in the space by injecting the resin through the resin injection hole. - View Dependent Claims (14, 15, 16, 17)
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Specification