Transmitter optical sub assembly, for instance for high speed optical transceivers

• US 20040184742A1
• Filed: 03/19/2004
• Published: 09/23/2004
• Est. Priority Date: 03/19/2003
• Status: Active Grant

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rossi, Giammarco, Di Mascio, Ernico, Sabbatino, Salvatore, Lupo, Silvio
• Granted Patent: US 7,203,219 B2
• Time in Patent Office: Days
• US Class Current: 385/92
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/02469 Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
• CPC Class Codes: H01S 5/042 Electrical excitation ; Circuits therefor monolithically integrated laser drive components H01S5/0261
• CPC Class Codes: H01S 5/06226 Modulation at ultra-high frequencies

Abstract

A transmitter optical sub assembly includes a laser source (10) having associated therewith a laser driver (18) and a package (24) for housing the laser source (10) and the laser driver (18). The package includes respective separate compartments (26, 30) for the laser source (10) and the laser driver (18), wherein a package wall, which is opaque to IR emission, separates the laser source (10) from the laser driver (18). The laser source (10) and the laser driver (18) are arranged in those separate compartments (26, 30) whereby the laser source (10) is exempt from being directly irradiated by the laser driver (18).

Claims

1. A transmitter optical sub assembly including a laser source having associated therewith a laser driver as well as a package for said laser source and said laser driver, wherein said package includes respective separate compartments for said laser source and said laser driver, the laser source and the laser driver being arranged in said separate compartments whereby said laser source is exempt from being directly irradiated by said laser driver.

2. The assembly of claim 1, wherein said package includes a package wall opaque to IR emission separating said laser source and said laser driver.

3. The assembly of either of claims 1 or 2, wherein said package is essentially comprised of a shaped body of an IR opaque material.

4. The assembly of either of claims 1 or 2, wherein said package is essentially comprised of a shaped body of a ceramics material.

5. The assembly of either of claims 1 or 2, wherein said package is essentially comprised of a shaped body of alumina.

6. The assembly of any of the previous claims, wherein the compartment provided in said package for said laser source is surrounded by walls.

7. The assembly of claim 6, wherein it includes feed through lines connecting said laser source to said laser driver, and in that said feed through lines extend through the walls of said compartment provided in said package for said laser source.

8. The assembly of any of the previous claims, wherein it includes feed through lines connecting said laser source to said laser driver, wherein said lines are laid out onto a substrate such an alumina substrate.

9. The assembly of any of the previous claims, wherein said package includes a compartment for hosting said laser source together with alignment optics associated therewith.

10. The assembly of any of the previous claims, wherein the compartment provided in said package for said laser driver is defined by a base member extending from the body of the package.

11. The assembly of any of the previous claims, wherein the compartment provided in said package for said laser driver is defined by a base member exempt from boundary walls.

12. The assembly of any of the previous claims, wherein the compartment provided in said package for said laser driver includes a recess for at least partly housing the laser driver.

13. The assembly of any of the previous claims, wherein the compartment provided in said package for said laser driver has associated a thermal path extending through the package.

14. The assembly of claim 13, wherein said thermal path includes at least one metalization extending through the package.

15. The assembly of either of claims 13 or 14, wherein said thermal path extends towards a plate.

16. The assembly of claim 15, wherein said plate is generally exposed to the outside surface of the package.

17. The assembly of either of claims 15 or 16, wherein said plate includes a ribbed configuration to guarantee thermal dissipation.

18. A transmitter optical sub assembly including a laser source having associated therewith a laser driver as well as a package for said laser source and said laser driver, wherein said package includes respective separate compartments for said laser source and said laser driver, the laser source and the laser driver being arranged in said separate compartments whereby said laser source is exempt from being directly irradiated by said laser driver, and said compartment provided in said package for said laser driver is defined by a base member exempt from boundary walls.