Substrate treatment process and apparatus

• US 20040194812A1
• Filed: 04/20/2004
• Published: 10/07/2004
• Est. Priority Date: 12/24/1999
• Status: Active Grant

• Current Assignee: M.FSI Ltd.
• Original Assignee: MFsi Limited
• Inventors: Iga, Masao, Matsuno, Kousaku
• Granted Patent: US 6,983,756 B2
• Time in Patent Office: Days
• US Class Current: 134/27
• CPC Class Codes: B08B 3/12 by sonic or ultrasonic vibrations washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves A47L15/13; of natural teeth, of prostheses using ultrasonic techniques similar to those used for natural teeth A61C17/20; application of ultrasonic vibrations to chemical, physical or physico-chemical processes in general B01J19/10
• CPC Class Codes: H05K 3/26 Cleaning or polishing of the conductive pattern
• CPC Class Codes: Y10S 134/902 Semiconductor wafer
• CPC Class Codes: Y10S 438/905 Cleaning of reaction chamber

Abstract

A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time. A substrate treatment apparatus is also disclosed for a substrate. The apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety. The nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from the nozzle unit reaches, with an area range having a length not smaller than a diameter of the substrate and a width smaller than the diameter of the substrate, the substrate.

Claims

1. (canceled)

2. A substrate treatment process for removing organic matter existing on a substrate, comprising:

treating said substrate with ozone-hydrogen water, prepared by dissolving an ozone-containing gas and a hydrogen-containing gas in ultrapure water, or ozone hydrogen water prepared by mixing ozone water, prepared by dissolving an ozone-containing gas in ultrapure water and hydrogen water prepared by dissolving a hydrogen-containing gas in ultrapure water, or treating said substrate with said ozone water and said hydrogen water at the same time.

3-20. -20. (canceled)

21. A substrate treatment apparatus for a substrate, comprising:

a treatment vessel;

a substrate holder configured to rotate said substrate in a horizontal plane in said treatment vessel;

a nozzle unit arranged in an upper part of said treatment vessel such that a liquid is downwardly fed;

a feed line configured to feed the liquid to said nozzle unit; and

a chamber configured to enclose therein said apparatus in its entirety,

wherein said nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from said nozzle unit reaches, with an area range having a length not smaller than a diameter of said substrate and a width smaller than said diameter of said substrate.

22. A substrate treatment apparatus according to claim 21, further comprising an ultrasonic wave generator arranged in said nozzle unit.

23. A substrate treatment apparatus according to claim 22, wherein said nozzle unit is provided with at least one flow channel for ozone water, at least one flow channel for hydrogen water or at least one flow channel for ozone-hydrogen water, and said flow channel is shielded from ultrasonic waves.