Method for fabricating an interference display unit
First Claim
Patent Images
1. A method for manufacturing an optical interference display unit disposed on a substrate, the method comprising:
- forming a first electrode on the substrate;
forming a sacrificial layer on the first electrode;
forming at least two openings in the sacrificial layer and the first electrode to define a position of the optical interference display unit;
forming a first photosensitive material layer to fill the openings and cover the sacrificial layer;
patterning the first photosensitive material layer to form a support in each of the openings and at least one first supporting layer on the support, wherein the support and the at least one first supporting layer form a post;
forming at least one second photosensitive material layer on the sacrificial layer and the at least one first supporting layer;
patterning the at least one second photosensitive material layer to form a second supporting layer on the at least one first supporting layer, wherein the at least one first supporting layer and the second supporting layer form an arm;
forming a second electrode on the sacrificial layer and the arm;
performing a thermal process; and
removing the sacrificial layer.
5 Assignments
0 Petitions
Accused Products
Abstract
A method for fabricating an interference display unit is disclosed. A first wall and a sacrificial layer are formed in order on a substrate and an opening is formed in the first wall and the sacrificial layer. A first photoresist layer is spin-coated on the sacrificial layer and fills the openings. A post having a first arm is formed through patterning the first photoresist layer. At least a second photoresist is formed by spin-coating. A second arm is formed on the first arm through patterning the second photoresist layer. A second wall is formed on the sacrificial layer and posts. The first and the second arms'"'"' stress is released through a thermal process. The position of the arm is shifted and the distance between the first wall and the second wall is therefore defined. Finally, the sacrificial layer is removed.
248 Citations
19 Claims
-
1. A method for manufacturing an optical interference display unit disposed on a substrate, the method comprising:
-
forming a first electrode on the substrate;
forming a sacrificial layer on the first electrode;
forming at least two openings in the sacrificial layer and the first electrode to define a position of the optical interference display unit;
forming a first photosensitive material layer to fill the openings and cover the sacrificial layer;
patterning the first photosensitive material layer to form a support in each of the openings and at least one first supporting layer on the support, wherein the support and the at least one first supporting layer form a post;
forming at least one second photosensitive material layer on the sacrificial layer and the at least one first supporting layer;
patterning the at least one second photosensitive material layer to form a second supporting layer on the at least one first supporting layer, wherein the at least one first supporting layer and the second supporting layer form an arm;
forming a second electrode on the sacrificial layer and the arm;
performing a thermal process; and
removing the sacrificial layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method for manufacturing a matrix color optical interference display unit disposed on a substrate, the method comprising:
-
forming a first electrode on the substrate;
forming a sacrificial layer on the first electrode;
forming at least four openings in the sacrificial layer and the first electrode to define positions of a first optical interference display unit, a second optical interference display unit, and a third optical interference display unit;
forming a support in each of the openings and at least one first supporting layer on the support, wherein the at least one first supporting layer forms a first arm;
forming at least one second supporting layer on the at least one first supporting layer of the second optical interference display unit and the third optical interference display unit, wherein the at least one first supporting layer and the at least one second supporting layer form a second arm;
forming at least one third supporting layer on the at least one second supporting layer of the third optical interference display unit to increase the thickness thereof, wherein the at least one first supporting layer, the at least one second supporting layer, and the at least one third supporting layer form a third arm;
forming a second electrode on the sacrificial layer and the first arm, the second arm, and the third arm;
performing a thermal process; and
removing the sacrificial layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
-
Specification
-
- Resources
Litigation Campaign Assessment
Thank you for your request. You will receive a custom alert email when the Litigation Campaign Assessment is available.
×
-
Current AssigneeSnaptrack Incorporated (Qualcomm, Inc.)
-
Original AssigneeSnaptrack Incorporated (Qualcomm, Inc.)
-
InventorsLin, Wen-Jian
-
Application NumberUS10/713,508Publication NumberTime in Patent OfficeDaysField of SearchUS Class Current430/315CPC Class CodesB81B 2201/047 Optical MEMS not provided f...B81C 1/00182 Arrangements of deformable ...G02B 26/001 based on interference in an...
