Surface acoustic wave pressure sensor with microstructure sensing elements
First Claim
1. A pressure sensor system, said system comprising:
- at least one microstructure temperature-sensing element formed on a substrate;
at least one microstructure pressure-sensing element located above a sensor diaphragm on said substrate; and
at least two contacts which protrude through said substrate for support of said pressure sensor system.
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Accused Products
Abstract
A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.
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Citations
20 Claims
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1. A pressure sensor system, said system comprising:
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at least one microstructure temperature-sensing element formed on a substrate;
at least one microstructure pressure-sensing element located above a sensor diaphragm on said substrate; and
at least two contacts which protrude through said substrate for support of said pressure sensor system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A pressure sensor system, said system comprising:
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at least one microstructure temperature-sensing element formed on a substrate within a hermetically sealed area thereof, wherein said at least one microstructure temperature-sensing element comprises at least one SAW temperature-sensing element;
at least one microstructure pressure-sensing element located above a sensor diaphragm on said substrate, wherein said at least one microstructure pressure-sensing element comprises at least one SAW pressure-sensing element; and
at least two contacts which assist in maintaining said hermetically sealed area and which protrude through said substrate for support of said pressure sensor system.
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14. A pressure sensor method, said method comprising:
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forming at least one microstructure temperature-sensing element on a substrate;
locating at least one microstructure pressure-sensing element above a sensor diaphragm on said substrate; and
providing at least two contacts, which protrude through said substrate for support of said pressure sensor system. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification