Probe for testing a device under test
First Claim
Patent Images
1. A probe comprising:
- (a) a dielectric substrate;
(b) an elongate conductor suitable to be electrically interconnected to a test signal supported by a first side of said substrate;
(c) a conductive member suitable to be electrically interconnected to a ground signal supported by said second side of said substrate wherein said conductive member is under a majority of the length of said elongate conductor;
(d) a conductive path between said first side of said substrate and said second side of said substrate and said conductive path free from electrical interconnection with said conductive member;
(e) a contact electrically interconnected to said conductive path for testing a device under test; and
(f) wherein said substrate has a thickness of less than 40 microns with a dielectric constant of less than 7.
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Abstract
A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
46 Citations
60 Claims
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1. A probe comprising:
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(a) a dielectric substrate;
(b) an elongate conductor suitable to be electrically interconnected to a test signal supported by a first side of said substrate;
(c) a conductive member suitable to be electrically interconnected to a ground signal supported by said second side of said substrate wherein said conductive member is under a majority of the length of said elongate conductor;
(d) a conductive path between said first side of said substrate and said second side of said substrate and said conductive path free from electrical interconnection with said conductive member;
(e) a contact electrically interconnected to said conductive path for testing a device under test; and
(f) wherein said substrate has a thickness of less than 40 microns with a dielectric constant of less than 7. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A probe comprising:
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(a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by said second side of said substrate wherein said conductive member is under a majority of the length of said elongate conductor;
(b) a conductive path between said first side of said substrate and said second side of said substrate;
(c) a contact electrically interconnected to said conductive path for testing a device under test; and
(d) wherein said substrate has a thickness of less than 40 microns with a dielectric constant of less than 7. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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45. A probe comprising:
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(a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by said second side of said substrate;
(b) a conductive path between said first side of said substrate and said second side of said substrate;
(c) a contact electrically interconnected to said conductive path for testing a device under test; and
(d) a co-axial cable interconnected to said dielectric substrate, wherein said co-axial cable is maintained in a tensioned state when said contact is free from being engaged with said device under test. - View Dependent Claims (46, 47, 48, 49, 60)
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50. A probe comprising:
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(a) a dielectric substrate supporting an elongate conductor;
(b) a probing element electrically interconnected to said elongate conductor for testing a device under test; and
(c) a co-axial cable interconnected to said dielectric substrate, wherein said co-axial cable is maintained in a tensioned state when said contact is free from being engaged with said device under test. - View Dependent Claims (51, 52, 53)
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54. A probe comprising:
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(a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by said second side of said substrate;
(b) a conductive path between said first side of said substrate and said second side of said substrate;
(c) a contact electrically interconnected to said conductive path for testing a device under test; and
(d) wherein said contact has a height relative to the adjoining surface of said dielectric substrate of less than 150 microns. - View Dependent Claims (55, 56, 57, 58, 59)
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Specification