Packaged device adapter assembly with alignment structure and methods regarding same

• US 20040242030A1
• Filed: 05/30/2003
• Published: 12/02/2004
• Est. Priority Date: 05/30/2003
• Status: Active Grant

• Current Assignee: Ironwood Pharmaceuticals, Inc.
• Original Assignee: Ironwood Pharmaceuticals, Inc.
• Inventors: Palaniappa, Ilavarasan, Fedde, Mickiel, Cramer, Jason Allen
• Granted Patent: US 6,877,993 B2
• Time in Patent Office: Days
• US Class Current: 439/73
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/4006 with bolts or screws

Abstract

A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Claims

1. An adapter apparatus for receiving a packaged device having a plurality of contact elements disposed on a surface thereof, wherein the packaged device further comprises one or more perimeter side surfaces defining an outer perimeter of the packaged device, the adapter apparatus comprising:

a perimeter wall member comprising a length along an adapter axis between a first end region of the adapter apparatus and a second end region of the adapter apparatus;

a conductive element layer comprising a plurality of arranged conductive elements, wherein the conductive element layer is positioned at the first end region of the adapter apparatus orthogonal to the adapter axis, and further wherein the perimeter wall member and the conductive element layer define a socket cavity adapted to receive the packaged device with the plurality of contact elements thereof adjacent the conductive element layer; and

an alignment structure positioned at the first end region to align the packaged device within the socket cavity, wherein the alignment structure comprises an alignment plate positioned orthogonal to the adapter axis, wherein the alignment plate comprises at least one opening defined therein adapted to allow the contact elements of the packaged device to be in electrical contact with the arranged conductive elements of the conductive element layer, and further wherein the alignment plate comprises a plurality of movable elements configured to movably engage the one or more perimeter side surfaces of the packaged device when the packaged device is positioned in the socket cavity adjacent the conductive element layer.

2. The adapter apparatus of claim 1, wherein the plurality of movable elements comprise two sets of movable elements configured in opposing relation to one another such that each of the two sets of movable elements are adapted to movably engage at least one of the one or more perimeter side surfaces of the packaged device when the packaged device is received in the socket cavity adjacent the conductive element layer.

3. The adapter apparatus of claim 1, wherein the packaged device is a packaged device having at least two opposing corners, wherein two perimeter side surfaces of the packaged device intersect at each of the at least two opposing corners, wherein the plurality of movable elements comprise two pairs of movable elements configured in opposing relation to one another such that each pair of the two pairs of movable elements movably engage the two perimeter side surfaces that intersect at one of the two opposing corners when the packaged device is received in the socket cavity adjacent the conductive element layer.

4. The adapter apparatus of claim 1, wherein the plurality of movable elements comprise one or more surfaces adapted to engage the one or more perimeter side surfaces of the packaged device when the packaged device is positioned in the socket cavity adjacent the conductive element layer, wherein the plurality of movable elements are adapted to move from a normal state when a packaged device has not been received in the socket cavity to a flex state when the packaged device is positioned in the socket cavity adjacent the conductive element layer, wherein the position of the one or more surfaces of the plurality of movable elements are at a distance further from the adapter axis when the plurality of movable elements are in the flex state as compared to when the plurality of movable elements are in the normal state.

5. The adapter apparatus of claim 1, wherein the plurality of movable elements have a thickness in the direction of the adapter axis that is less than a thickness of the packaged device.

6. The adapter apparatus of claim 1, wherein the alignment plate comprises a body portion comprising one or more fixed inner perimeter surfaces defining the at least one opening, wherein the one or more fixed inner perimeter surfaces define a maximum outer perimeter of the packaged device to be received in the socket cavity, wherein the body portion corresponds to and is positioned adjacent an end of the perimeter wall member at the first end region of the adapter apparatus, wherein the plurality of movable elements extend from the body portion of the alignment plate.

7. The adapter apparatus of claim 6, wherein the alignment structure further comprises a spacer structure that is adapted to define a free space adjacent the plurality of movable elements so as to allow the plurality of movable elements to move from a normal state when the packaged device has not been received in the socket cavity to a flex state when the packaged device is positioned in the socket cavity adjacent the conductive element layer.

8. The adapter apparatus of claim 7, wherein the spacer structure comprises the body portion, wherein the body portion corresponding to the perimeter wall member has a thickness in the direction of the adapter axis that is greater than the thickness of the plurality of movable elements in the direction of the adapter axis.

9. The adapter apparatus of claim 7, wherein the spacer structure comprises a spacer plate corresponding to the body portion of the alignment plate and positioned adjacent thereto, wherein the spacer plate when positioned adjacent the alignment plate is void of material in a space directly above the plurality of movable elements.

10. The adapter apparatus of claim 1, wherein the packaged device comprises one of a micro lead frame package, a micro lead chip carrier, a quad flat no lead package, micro ball grid array, and a micro land grid array.

11. The adapter apparatus of claim 1, wherein one or more of the plurality of movable elements comprises a beveled edge at an upper surface thereof.

12. The adapter apparatus of claim 1, wherein the conductive element layer comprises a conductive elastomer layer.

13. The adapter apparatus of claim 12, wherein the conductive elastomer layer comprises conductive elements therein that are at an angle relative to the adapter axis, and further wherein the adapter apparatus comprises a conductive element layer alignment structure positioned at the first end region of the adapter apparatus comprising a surface facing the adapter axis that is at an angle relative to the adapter axis for use in positioning the angled conductive elements of the conductive elastomer layer.

14. The adapter apparatus of claim 1, wherein the plurality of movable elements are operable to provide opposing forces on the one or more perimeter side surfaces of the packaged device.

15. The adapter apparatus of claim 1, wherein adapter apparatus further comprises:

an actuator apparatus comprising a floating member movable in the socket cavity and an actuator element, wherein the actuator element is operable to provide a force on the floating member such that a corresponding force is distributed to the packaged device when received in the socket cavity such that the plurality of contact elements are in electrical contact with the arranged conductive elements of the conductive element layer; and

a cover member positioned at the second end region of the adapter apparatus to close the socket cavity, wherein the cover member is movable to allow the packaged device to be removed from the socket cavity.

16. The adapter apparatus of claim 15, wherein at least one opening is defined in the cover member and the floating member to allow access to the packaged device when positioned in the socket cavity adjacent the conductive element layer.

17. The adapter apparatus of claim 1, wherein the adapter apparatus is coupled to an interconnect board such that the arranged conductive elements are electrically coupled to contact pads on a first side of the interconnect board, and further wherein the interconnect board comprises electrical connection elements for mounting the interconnect board relative to a target board.

18. An apparatus for use in an adapter configured to receive a packaged device having a plurality of contact elements disposed on a surface thereof, wherein the packaged device further comprises one or more perimeter side surfaces defining an outer perimeter of the packaged device, the apparatus comprising an alignment plate, wherein the alignment plate comprises:

a body portion comprising one or more fixed inner perimeter surfaces defining an opening about an axis orthogonal to the alignment plate, wherein the one or more fixed inner perimeter surfaces define a maximum outer perimeter of the packaged device; and

a plurality of movable elements extending from the body portion of the alignment plate, wherein the plurality of movable elements are configured to movably engage the one or more perimeter side surfaces of the packaged device when the packaged device is positioned in the opening.

19. The apparatus of claim 18, wherein the plurality of movable elements comprise two sets of movable elements configured in opposing relation to one another such that each of the two sets of movable elements are adapted to movably engage at least one of the one or more perimeter side surfaces of the packaged device when the packaged device is received in the opening.

20. The apparatus of claim 18, wherein the packaged device is a packaged device having at least two opposing corners, wherein two perimeter side surfaces of the packaged device intersect at each of the at least two opposing corners, wherein the plurality of movable elements comprise two pairs of movable elements configured in opposing relation to one another such that each pair of the two pairs of movable elements movably engage the two perimeter side surfaces that intersect at one of the two opposing corners when the packaged device is received in the opening.

21. The apparatus of claim 18, wherein the plurality of movable elements comprise one or more surfaces adapted to engage the one or more perimeter side surfaces of the packaged device when the packaged device is positioned in the opening, wherein the plurality of movable elements are adapted to move from a normal state when a packaged device has not been received in the opening to a flex state when the packaged device is positioned in the opening, wherein the position of the one or more surfaces of the plurality of movable elements are at a distance further from the axis when the plurality of movable elements are in the flex state as compared to when the plurality of movable elements are in the normal state.

22. The apparatus of claim 18, wherein the plurality of movable elements have a thickness in the direction of the axis that is less than a thickness of the packaged device.

23. The apparatus of claim 18, wherein the apparatus further comprises a comprises a spacer plate corresponding to the body portion of the alignment plate and positioned adjacent thereto, wherein the spacer plate when positioned adjacent the alignment plate is void of material in a space directly above the plurality of movable elements.

24. The apparatus of claim 18, wherein the body portion has a thickness in the direction of the adapter axis that is greater than the thickness of the plurality of movable elements in the direction of the adapter axis.

25. The apparatus of claim 18, wherein the packaged device comprises one of a micro lead frame package, a micro lead chip carrier, a quad flat no lead package, micro ball grid array, and a micro land grid array.

26. The apparatus of claim 18, wherein one or more of the plurality of movable elements comprises a beveled edge at an upper surface thereof.

27. The apparatus of claim 18, wherein the plurality of movable elements are operable to provide opposing forces on the one or more perimeter side surfaces of the packaged device when the packaged device is positioned in the opening.

28. A method of aligning a packaged device in an adapter apparatus, wherein the packaged device comprises a plurality of contact elements disposed on a surface thereof, wherein the packaged device further comprises one or more perimeter side surfaces defining an outer perimeter of the packaged device, wherein the method comprises:

providing an adapter apparatus defining a socket cavity for receiving the packaged device, wherein the adapter apparatus comprises an alignment plate, wherein the alignment plate comprises a body portion comprising one or more fixed inner perimeter surfaces defining an opening about an axis orthogonal to the alignment plate, and further wherein the alignment plate comprises a plurality of movable elements extending from the body portion of the alignment plate, wherein the plurality of movable elements are in a normal state when a packaged device has not been received in the opening; and

positioning the packaged device in the socket cavity such that the plurality of movable elements are moved to a flex state, wherein a position of one or more surfaces of the plurality of movable elements are at a distance further from the axis when the plurality of movable elements are in the flex state as compared to when the plurality of movable elements are in the normal state.

29. The method of claim 28, wherein the packaged device comprises one of a micro lead frame package, a micro lead chip carrier, a quad flat no lead package, micro ball grid array, and a micro land grid array.

30. The method of claim 28, wherein one or more of the plurality of movable elements comprise a beveled edge at an upper surface thereof, wherein positioning the packaged device in the socket cavity comprises engaging one or more edges of the packaged device with the beveled edge of one or more of the plurality of movable elements forcing the movable elements from the normal state to the flex state.

31. The method of claim 28, wherein the method further comprises providing, with use of the plurality of movable elements, opposing forces on the one or more perimeter side surfaces of the packaged device when the packaged device is positioned in the opening to hold the packaged device in an aligned position in the socket cavity.