Bonding material and bonding method

• US 20040245648A1
• Filed: 07/30/2004
• Published: 12/09/2004
• Est. Priority Date: 09/18/2002
• Status: Abandoned Application

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Nagasawa, Hiroshi, Hirose, Masayoshi, Chikamori, Yusuke, Ogure, Naoaki, Kagoshima, Kaori
• Application Number:
  US10/484,454
• Publication Number:
  US 20040245648A1
• Time in Patent Office: Days
• US Class Current: 257/772
• CPC Class Codes: B22F 1/054 Nanosized particles
• CPC Class Codes: B22F 1/0545 Dispersions or suspensions of nanosized particles
• CPC Class Codes: B22F 1/10 Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
• CPC Class Codes: B22F 1/102 Metallic powder coated with organic material
• CPC Class Codes: B22F 2998/00 Supplementary information concerning processes or compositions relating to powder metallurgy
• CPC Class Codes: B22F 2999/00 Aspects linked to processes or compositions used in powder metallurgy
• CPC Class Codes: B22F 7/064 using an intermediate powder layer
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/3006 Ag as the principal constituent
• CPC Class Codes: B23K 35/3612 with organic compounds as principal constituents
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: C09J 2400/163 in the substrate
• CPC Class Codes: C09J 5/06 involving heating of the applied adhesive
• CPC Class Codes: H01L 2224/11332 using a powder
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/2949 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81192 : wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8121 : using a reflow oven
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/8184 : Sintering
• CPC Class Codes: H01L 23/4828 : Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2201/0224 : Conductive particles having an insulating coating
• CPC Class Codes: H05K 2201/0257 : Nanoparticles inks comprising nanoparticles H05K1/097
• CPC Class Codes: H05K 2203/1572 : Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/321 : by conductive adhesives

Abstract

There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.

Claims

1. A bonding material for use in a stepwise bonding process including at least two bonding steps, comprising a dispersion in an organic solvent of composite metallic nano-particles, said composite metallic nano-particles each having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm is combined and coated with an organic material, and said dispersion being in a liquid form.

4. The bonding material according to claim 1 further comprising an aggregate having an average particle size of not more than 100 μ

m.

5. The bonding material according to claim 4, wherein the aggregate is of a metallic material, a plastic material, or an inorganic material, or a combination thereof.

6. The bonding material according to claim 5, wherein the inorganic material comprises a ceramics, carbon, diamond or glass material.

7. The bonding material according to claim 1, wherein the metal core portion of the composite metallic nano-particles is composed of either one of Au, Ag, Pd, Pt, Cu, and Ni, or a combination of two or more thereof.

2. A bonding material for use in a stepwise bonding process comprising at least two bonding steps, comprising a dispersion in an organic solvent of composite metallic nano-particles, said composite metallic nano-particles each having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm is combined and coated with an organic material, and said dispersion being in the form of a slurry, paste or cream.

26. The bonding material according to claim 2 further comprising an aggregate having an average particle size of not more than 100 μ

m.

28. The bonding material according to claim 2, wherein the metal core portion of the composite metallic nano-particles is composed of either one of Au, Ag, Pd, Pt, Cu, and Ni, or a combination of two or more thereof.

3. A bonding material for use in a stepwise bonding process containing at least two bonding steps, comprising a dispersion in an organic solvent of composite metallic nano-particles, said composite metallic nano-particles each having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm is combined and coated with an organic material, and said dispersion being in a solid or jellylike form.

27. The bonding material according to claim 3 further comprising an aggregate having an average particle size of not more than 100 μ

m.

29. The bonding material according to claim 3, wherein the metal core portion of the composite metallic nano-particles is composed of either one of Au, Ag, Pd, Pt, Cu, and Ni, or a combination of two or more thereof.

8. A bonding method for bonding at least two parts together, comprising:

allowing a bonding material to be present between and in contact with predetermined portions of the parts, said bonding material containing as a main bonding material composite metallic nano-particles each having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm is combined and coated with an organic material; and

applying an energy to the bonding material to change the form of the composite metallic nano-particles contained in the bonding material, thereby releasing the organic material from the composite metallic nano-particles and bonding the metal cores together, and the metal core and a surface of said parts.

9. The bonding method according to claim 8, wherein the bonding is carried out in the air, in a dry air, in an oxidizing gas atmosphere, in an inert gas atmosphere, in vacuum, or in an atmosphere with reduced mist.

10. The bonding method according to claim 8, wherein the bonding surface of the part is subjected to a surface treatment in advance of the bonding.

11. The bonding method according to claim 8 further comprising bonding another part to the bonded structure of said parts, in which the form of the composite metallic nano-particles contained in the bonding material has changed, by using the same bonding material.

12. The bonding method according to claim 11, wherein said another part is a structure composed of at least two independent parts.

13. A bonding material for bonding members together through heating of the bonding material at a bonding temperature (centigrade temperature) or higher and solidification of the bonding material, comprising composite metallic nano-particles each consisting of a metal core composed of a metal, and an organic material which is combined with the metal core and covers it, wherein a temperature (centigrade temperature) at which said bonding material re-melts after the solidification is at least twice higher than said bonding temperature.

14. A bonding material for bonding members together through heating of the bonding material at a bonding temperature (centigrade temperature) or higher and sintering of the bonding material, said bonding material being in a solid or material form at room temperature, wherein a temperature (centigrade temperature) at which said bonding material re-melts after the sintering is at least twice higher than said bonding temperature.

15. A bonding material for bonding members together through heating of the bonding material at a bonding temperature (centigrade temperature) or higher and solidification of the bonding material, comprising composite metallic nano-particles each consisting of a metal core composed of a metal, and an organic material which is chemically combined with the metal core and covers it, said organic material not containing nitrogen nor sulfur, wherein a temperature (centigrade temperature) at which said bonding material re-melts after the solidification is at least twice higher than said bonding temperature.

16. A bonding method comprising:

allowing a bonding material to be present between and in contact with at least two parts to be bonded, said bonding material containing composite metallic nano-particles each having such a structure that a metal core of a metal particle having a diameter of 0.5 nm to 100 nm is combined and coated with an organic material;

heating the bonding material at a temperature which is equal to or higher than the decomposition initiating temperature of the organic material, but lower than the melting point of the metal in a bulk state to release the organic material from the metal core of the bonding material present between the parts and sinter the metal core, thereby forming a bulk metal and bonding the parts together to obtain a bonded member;

allowing the same bonding material to be present between and in contact with the bonded member and another member; and

heating the bonding material at a temperature which is equal to or higher than the decomposition initiating temperature of the organic material, but lower then the melting point of the metal in a bulk state to release the organic material from the metal core of the bonding material present between the members and sinter the metal core without melting said bulk metal, thereby bonding the bonded member and another member.

17. A bonding method comprising:

allowing a bonding material to be present between and in contact with at least two parts to be bonded, said bonding material containing composite metallic nano-particles each having such a structure that a metal core of a metal particle having a diameter of 0.5 nm to 100 nm is combined and coated with an organic material, such that the clearance between the parts is 10 to 10,000 times the size of the metal core contained in the bonding material; and

heating the bonding material at a temperature which is equal to or higher than the decomposition initiating temperature of the organic material, but lower than the melting point of the metal in a bulk state to release the organic material from the metal core of the bonding material present between the parts and sinter the metal core, thereby forming a bulk metal and bonding the parts together.

18. A multi-electrode substrate for bonding of electrodes of the substrate to electrodes of another substrate, comprising a plurality of electrodes and a bonding material that has been applied onto the electrodes, said bonding material containing as a main bonding material composite metallic nano-particles each having such a structure that a metal core having an average diameter of not more than 100 nm is combined and coated with an organic material not containing nitrogen nor sulfur.

19. An electrode bonding method comprising:

allowing a bonding material to be present between and in contact with electrodes of a substrate and electrodes of another substrate, said bonding material containing as a main bonding material composite metallic nano-particles each having such a structure that a metal core having an average diameter of not more than 100 nm is combined and coated with an organic material not containing nitrogen nor sulfur; and

changing the form of the composite metallic nano-particles contained in the bonding material, thereby bonding said electrodes together.

20. A bonded structure, comprising at least two members bonded together via a bonding portion, said bonding portion containing a sintered metal portion having a sintered metal structure, said sintered metal portion having been obtained by allowing a bonding material to be present between the members, said bonding material containing as a main bonding material composite metallic nano-particles having a metal core of a metal particle combined and coated with an organic material, and heating or firing the bonding material while holding it at a predetermined position to bond said members together.

21. A metallizing apparatus for heating or firing a bonding material comprising a dispersion in a solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle is combined and coated with an organic material to decompose and evaporate the organic material and sinter the metal particles, thereby metallizing the bonding material, comprising an inertial force energy application device for applying an inertial force energy to the bonding material.

22. The metallizing apparatus according to claim 21, wherein the inertial force energy application device is comprised of at least one of a device for applying a shaking energy to the bonding material, a device for applying a vibrational energy to the bonding material and a device for applying an impact energy to the bonding material.

23. The metallizing apparatus according to claim 21, wherein said bonding material is used for coating of a substrate, embedding of the metal in a fine recess formed in a substrate, bonding between members, or production of small-sized parts.

24. A metallizing apparatus for heating or firing a bonding material comprising a dispersion in a solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle is combined and coated with an organic material to decompose and evaporate the organic material and sinter the metal particles, thereby metallizing the bonding material, comprising:

a hermetically closable chamber for housing the bonding material therein; and

a deaerating device for deaerating the interior of the chamber.

25. The metallizing apparatus according to claim 24, wherein said bonding material is used for coating of a substrate, embedding of the metal in a fine recess formed in a substrate, bonding of members, or production of small-sized parts.