Microelectromechanical systems, and methods for encapsualting and fabricating same
First Claim
1. A method of sealing a chamber of an electromechanical device having a mechanical structure overlying a substrate, wherein the mechanical structure is in the chamber, the method comprising:
- depositing a sacrificial layer over at least a portion of the mechanical structure;
depositing a first encapsulation layer over the sacrificial layer;
forming at least one vent through the first encapsulation layer to allow removal of at least a portion of the sacrificial layer;
removing at least a portion of the sacrificial layer to form the chamber;
depositing a second encapsulation layer over or in the vent to seal the chamber wherein the second encapsulation layer is a semiconductor material.
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Accused Products
Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
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Citations
29 Claims
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1. A method of sealing a chamber of an electromechanical device having a mechanical structure overlying a substrate, wherein the mechanical structure is in the chamber, the method comprising:
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depositing a sacrificial layer over at least a portion of the mechanical structure;
depositing a first encapsulation layer over the sacrificial layer;
forming at least one vent through the first encapsulation layer to allow removal of at least a portion of the sacrificial layer;
removing at least a portion of the sacrificial layer to form the chamber;
depositing a second encapsulation layer over or in the vent to seal the chamber wherein the second encapsulation layer is a semiconductor material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing an electromechanical device having a mechanical structure that resides in a chamber and wherein the chamber includes a fluid having a pressure that provides mechanical damping for the mechanical structure, the method comprising:
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depositing a first encapsulation layer over the mechanical structure wherein the first encapsulation layer is a semiconductor material;
forming at least one vent in the first encapsulation layer;
forming the chamber; and
depositing a second encapsulation layer over or in the vent to seal the chamber wherein the second encapsulation layer is a semiconductor material. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. An electromechanical device comprising:
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a chamber including a first encapsulation layer having at least one vent;
a mechanical structure, wherein at least a portion of the mechanical structure is disposed in the chamber;
a second encapsulation layer comprised of a semiconductor material, deposited over or in the vent, to thereby seal the chamber. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification