Thermal interface apparatus, systems, and methods
First Claim
Patent Images
1. An apparatus, comprising:
- a substrate;
a first material coupled to the substrate and having a first coefficient of thermal expansion; and
a second material coupled to the substrate and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion to reduce an amount of warp across a surface of the substrate within a selected temperature range.
2 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.
28 Citations
21 Claims
-
1. An apparatus, comprising:
-
a substrate;
a first material coupled to the substrate and having a first coefficient of thermal expansion; and
a second material coupled to the substrate and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion to reduce an amount of warp across a surface of the substrate within a selected temperature range. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. A system, comprising:
-
a wireless transceiver;
a substrate coupled to the wireless transceiver, a first material coupled to the substrate and having a first coefficient of thermal expansion; and
a second material coupled to the substrate and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion to reduce an amount of warp across a surface of the substrate within a selected temperature range. - View Dependent Claims (13, 14, 15)
-
-
16. A method, comprising:
-
coupling a first material having a first coefficient of thermal expansion to a substrate; and
coupling a second material to the substrate, the second material having a second coefficient of thermal expansion different from the first coefficient of thermal expansion to reduce an amount of warp across a surface of the substrate within a selected temperature range. - View Dependent Claims (17, 18, 19, 20, 21)
-
Specification