Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void

• US 20040262257A1
• Filed: 06/07/2004
• Published: 12/30/2004
• Est. Priority Date: 04/26/2001
• Status: Active Grant

• Current Assignee: Mark A. Lucak, Michael J. Knieser, Richard Daniel Harris, Robert J. Kretschmann
• Original Assignee: Mark A. Lucak, Michael J. Knieser, Richard Daniel Harris, Robert J. Kretschmann
• Inventors: Kretschmann, Robert J., Harris, Richard D., Lucak, Mark A., Knieser, Michael J.
• Granted Patent: US 7,018,550 B2
• Time in Patent Office: Days
• US Class Current: 216/13
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81C 1/00484 Processes for releasing structures not provided for in group B81C1/00476
• CPC Class Codes: B81C 1/00626 Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations

Abstract

A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.

Claims

1. A method for fabricating a MEMS device onto a substrate having a movable MEMS element portion free from the substrate and disposed adjacent a stationary MEMS element that is in mechanical communication with the substrate, the method comprising the steps of:

(a) providing a wafer having opposed first and second surfaces;

(b) depositing a spacer material onto the first surface of the wafer;

(c) forming a recess within a middle portion of the spacer material.

(d) attaching the spacer material to the substrate to form a composite structure having a void disposed therein; and

(e) etching into the wafer towards the substrate to remove a portion of the wafer and release the movable MEMS element.

2. The method as recited in claim 1, wherein step (a) further comprises depositing a first layer onto the first surface of the wafer, and wherein step (b) further comprises depositing the spacer member onto the first layer.

3. The method as recited in claim 2, wherein step (c) further comprises etching a portion of the spacer member to form the recess.

4. The method as recited in claim 1, wherein step (C)further comprises forming a stationary MEMS element in communication with the substrate.

5. The method as recited in claim 4, wherein step (e) further comprises forming a gap between the movable MEMS element and the stationary MEMS element, the gap being at least partially aligned with the void.

6. The method as recited in claim 5, wherein the gap has a size that varies in response to movement by the movable MEMS element.

7. The method as recited in claim 4, wherein step (C) further comprises producing first and second conductive elements of the stationary MEMS element that are electrically isolated from each other.

8. The method as recited in claim 1, further comprising, after step (C), depositing an insulating layer onto the wafer in the recess.

9. The method as recited in claim 8, wherein the insulating layer is selected from the group consisting of silicon nitride and silicon dioxide.

10. The method as recited in claim 8, further comprising etching into the wafer to produce the movable MEMS element having at least two conductive elements that are electrically isolated from each other by the insulating layer.

11. The method as recited in claim 1, wherein the wafer is conductive.

12. The method as recited in claim 11 wherein the wafer comprises silicon.

13. The method as recited in claim 1, wherein the substrate is conductive.

14. The method as recited in claim 13, wherein the substrate is selected from the group consisting of silicon, silicon carbide, and gallium arsenide.

15. The method as recited in claim 1, wherein the spacer member is an insulator.

16. The method as recited in claim 1, wherein the substrate is nonconductive.

17. The method as recited in claim 1, wherein the substrate is selected from the group consisting of glass, high resistivity silicon, crystalline sapphire, and ceramic.