Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

• US 20040262645A1
• Filed: 04/30/2004
• Published: 12/30/2004
• Est. Priority Date: 05/18/2001
• Status: Active Grant

• Current Assignee: Corporation for National Research Initiatives
• Original Assignee: Corporation for National Research Initiatives
• Inventors: Huff, Michael A., Ozgur, Mehmet
• Granted Patent: US 7,012,327 B2
• Time in Patent Office: Days
• US Class Current: 257/232
• CPC Class Codes: B81B 2201/016 having a bridge fixed on two ends and connected to one or more dimples
• CPC Class Codes: B81B 2207/015 the micromechanical device and the control or processing electronics being integrated on the same substrate
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/092 Buried interconnects in the substrate or in the lid
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H01G 5/16 using variation of distance between electrodes
• CPC Class Codes: H01G 5/18 due to change in inclination, e.g. by flexing, by spiral wrapping
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01H 2057/006 Micromechanical piezoelectric relay
• CPC Class Codes: H01H 2059/0072 with stoppers or protrusions for maintaining a gap, reducing the contact area or for preventing stiction between the movable and the fixed electrode in the attracted position
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01P 1/127 Strip line switches
• CPC Class Codes: H01P 1/184 Strip line phase-shifters H01P1/181, H01P1/185, H01P1/19 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 15/0013 : said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
• CPC Class Codes: H01Q 15/004 : using superconducting materials or magnetised substrates
• CPC Class Codes: H01Q 21/0087 : Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 3/26 : varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture H01Q3/12, H01Q3/22, H01Q3/24 take precedence
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.

Claims

1-166. -166. (Canceled)

167. A phased array antenna system comprising:

a plurality of sub-array modules integrated together to form the phased array antenna, and

at least one amplifier connected to the plurality of sub-array modules,

each of the sub-array modules being comprised of a plurality of radiating elements, each of the radiating elements including;

a first module comprised of a first plurality of low-temperature co-fired ceramic (“

LTCC”

) layers forming at least one first circuit used in the operation of the phased array antenna;

a second module comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the phased-array antenna;

at least one radiating patch formed on the second module; and

at least one phase shifter fabricated from at least one microelectromechanical (“

MEMS”

) switch and formed between the first and second modules; and

wherein the second module is bonded to the first module so as to enclose the at least one MEMS phase shifter between the first and second modules.

168. The phased array antenna system recited in claim 167 wherein the second module is bonded to the first module to form a hermetically sealed chamber containing the at least one MEMS phase shifter.

169. The phased array antenna system recited in claim 167 wherein the first and second pluralities of LTCC layers are interconnected by vertical interconnects extending through the layers.

170. The phased array antenna system recited in claim 167 wherein the at least one second circuit formed in the second plurality of LTCC layers is a polarizer circuit.

171. The phased array antenna system recited in claim 167 wherein the at least one first circuit formed in the first plurality of LTCC layers is a plurality of circuits including a power divider circuit and a band pass filter circuit.

172. The phased array antenna system recited in claim 167 wherein the first plurality of LTCC layers includes a buffer layer that serves as a substrate on which the at least one MEMS phase shifter is fabricated.

173. The phased array antenna system recited in claim 167 further comprising at least one integrated circuit bonded to the first module.

174. The phased array antenna system recited in claim 173 wherein the first plurality of LTCC layers includes an interconnect layer through which the at least one integrated circuit is connected to the first module.

175. The phased array antenna system recited in claim 167 wherein the system includes a plurality of amplifiers, each of the amplifiers being connected to a corresponding one of the plurality of sub-array modules.

176. The phased array antenna system recited in claim 167 wherein each of the radiating elements includes a plurality of radiating patches and a corresponding plurality of MEMS phase shifters.

177. The phased array antenna system recited in claim 167 wherein the first plurality of LTCC layers includes a plurality of discrete components buried-in said layers.

178. The phased array antenna system recited in claim 177 wherein the plurality of buried-in discrete components is resistors, capacitors, and/or inductors.

179. The phased array antenna system recited in claim 167 wherein the first and second pluralities of LTCC layers include at least one passive microwave device selected from the group consisting of transmission lines, couplers, and dividers.

180. The phased array antenna system recited in claim 173 wherein the first plurality of LTCC layers includes a cavity in which the integrated circuits are bonded to the first array antenna.

181. The phased array antenna system recited in claim 173 wherein the integrated circuits include at least one circuit selected from a group consisting of low-frequency analog/digital ICs, MMICs, and RFICs.

182. The phased array antenna system recited in claim 173 wherein the integrated circuits include at least one circuit from a group consisting of a control circuit for the MEMS phase shifter, a power module for the MEMS phase shifter, a microprocessor, a signal processor, a high frequency power amplifier, a high frequency low noise amplifier, high frequency down or up converters.

183. The phased array antenna system recited in claim 167 wherein the second plurality of LTCC layers includes ground shielding extending through said layers to shield the at least one radiating element from radiating elements in other phase antennas.

184. The phased array antenna system recited in claim 167 wherein the first and second pluralities of LTCC layers include ground planes for shielding the first and second circuits.

185. The phased array antenna system recited in claim 172 wherein the buffer layer is a plurality of layers.

186. The phased array antenna system recited in claim 173 wherein the integrated circuits are flip-chip bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

187. The phased array antenna system recited in claim 173 wherein the integrated circuits are wire-bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

188. The phased array antenna system recited in claim 173 wherein the integrated circuits are flip-chip bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

189. The phased array antenna system recited in claim 173 wherein the integrated circuits are wire-bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

190. The phased array antenna system recited in claim 167 wherein the second plurality of LTCC layers includes a plurality of radiation layers on which is fabricated the at least one radiating element.

191. A phased array antenna system comprising:

a plurality of low-temperature co-fired ceramic (“

LTCC”

) modules integrated together, and

at least one amplifier connected to the plurality of LTCC modules, each LTCC module being a radiating element and being comprised of;

a first plurality of LTCC layers forming at least one first circuit used in the operation of the phased array antenna;

a second plurality of LTCC layers forming at least a second circuit used in the operation of the phased-array antenna;

at least one microelectromechanical (“

MEMS”

) device formed between the first and second pluralities of LTCC layers, the second plurality of LTCC layers being bonded to the first plurality of LTCC layers whereby the at least one MEMS device is enclosed between the first and second pluralities of LTCC layers; and

at least one radiating patch formed on the second plurality of LTCC layers.

192. The phased array antenna system recited in claim 191 wherein the second plurality of LTCC layers is bonded to the first plurality of LTCC layers to form a hermetically sealed chamber containing the at least one MEMS device.

193. The phased array antenna system recited in claim 191 wherein the first plurality of LTCC layers includes a buffer layer that serves as a substrate on which the at least one MEMS device is fabricated.

194. The phased array antenna system recited in claim 191 further comprising at least one integrated circuit bonded to the first plurality of LTCC layers.

195. The phased array antenna system recited in claim 194 further comprising a plurality of integrated circuits including at least one circuit from a group consisting of low-frequency analog/digital ICs, MMICs, and RFICs.

196. The phased array antenna system recited in claim 194 further comprising a plurality of integrated circuits including at least one circuit from a group consisting of a control circuit for the MEMS device, a power module for the MEMS device, a microprocessor, a signal processor, a high frequency power amplifier, a high frequency low noise amplifier, high frequency down-converters.

197-247. -247. (Canceled)

251-259. -259. (Canceled)

258. A phased array antenna system comprising:

a plurality of sub-array modules formed on a low-temperature co-fired ceramic (“

LTCC”

) wafer, and

at least one amplifier connected to the plurality of sub-array modules,

each of the sub-array modules being comprised of a plurality of radiating elements, each of the radiating elements including;

a first module comprised of a first plurality of LTCC layers forming at least one first circuit used in the operation of the phased array antenna;

a second module comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the phased-array antenna;

at least one radiating patch formed on the second module; and

at least one phase shifter fabricated from at least one microelectromechanical (“

MEMS”

) switch and formed between the first and second modules; and

wherein the second module is bonded to the first module so as to enclose the at least one MEMS phase shifter between the first and second modules.

259. A phased array antenna system comprising:

a plurality of sub-array modules integrated together to form the phased array antenna, each of the sub-array modules being comprised of a plurality of radiating elements, each of the radiating elements including;

a first module comprised of a first plurality of low-temperature co-fired ceramic (“

LTCC”

) layers forming at least one first circuit used in the operation of the phased array antenna;

a second module comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the phased-array antenna;

at least one radiating patch and at least one amplifier connected to the radiating patch formed on the second module; and

at least one phase shifter fabricated from at least one microelectromechanical (“

MEMS”

) switch and formed between the first and second modules; and

wherein the second module is bonded to the first module so as to enclose the at least one MEMS phase shifter between the first and second modules.

260. A phased array antenna system comprising:

a plurality of sub-array modules integrated together to form the phased array antenna, and

at least one amplifier connected to the plurality of sub-array modules,

each of the sub-array modules being comprised of a plurality of radiating elements, each of the radiating elements including;

at least a first module comprised of a first plurality of low-temperature co-fired ceramic (“

LTCC”

) layers forming at least one first circuit used in the operation of the phased array antenna;

at least a second module comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the phased-array antenna;

at least one radiating patch formed on the second module; and

at least one phase shifter fabricated from at least one microelectromechanical (“

MEMS”

) switch and formed between the first and second modules; and

wherein the second module is bonded to the first module so as to enclose the at least one MEMS phase shifter between the first and second modules.