Edge bead control method and apparatus
First Claim
Patent Images
1. A wafer receiving apparatus comprising:
- a body having a pocket shaped to receive a wafer, the pocket having a depth and an area which correspond to a wafer of a first size.
5 Assignments
0 Petitions
Accused Products
Abstract
Methods and devices for handling wafers during wafer processing are provided. One embodiment includes an apparatus for holding a wafer. The holding apparatus includes a pocket for receiving a wafer, and may include a mechanism allowing for the wafer to be secured within the pocket. Methods are also included for preparing a wafer for fabrication processes by the use of a wafer holding apparatus. These methods may include applying a layer of photoresist to the surface of a wafer.
103 Citations
20 Claims
-
1. A wafer receiving apparatus comprising:
a body having a pocket shaped to receive a wafer, the pocket having a depth and an area which correspond to a wafer of a first size. - View Dependent Claims (2, 3, 4)
-
5. A method of preparing a wafer for a fabrication process, the method comprising:
-
providing a wafer receiving apparatus for receiving a wafer of a first size, the wafer receiving apparatus including a recessed portion having a depth;
placing a wafer of the first size in the recessed portion of the wafer receiving apparatus;
applying photoresist to the wafer; and
spinning the wafer and the wafer receiving apparatus while the wafer is placed in the recessed portion of the wafer receiving apparatus. - View Dependent Claims (6, 7, 8, 9, 10, 11)
-
-
12. A method of reducing edge bead thickness while applying photoresist to a wafer comprising:
-
providing a wafer receiving apparatus for receiving a wafer of a first size, the wafer receiving apparatus including a pocket having a depth, wherein the depth is chosen to correspond to a wafer of the first size;
placing a wafer of the first size in the pocket of the wafer receiving apparatus;
applying photoresist to the wafer; and
spinning the wafer and the wafer receiving apparatus while the wafer is placed in the pocket to create a photoresist layer of a desired thickness. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
-
Specification