Silicon condenser microphone and manufacturing method
First Claim
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1. A microphone comprising:
- a multi-layer wall housing defining an internal cavity, a first layer of the multi-layer wall housing being non-conductive and a second layer of the multi-layer wall housing being a conductive layer;
an acoustic port formed in the multi-layer wall housing; and
a transducer disposed within the cavity in communication with the acoustic port.
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Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
187 Citations
29 Claims
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1. A microphone comprising:
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a multi-layer wall housing defining an internal cavity, a first layer of the multi-layer wall housing being non-conductive and a second layer of the multi-layer wall housing being a conductive layer;
an acoustic port formed in the multi-layer wall housing; and
a transducer disposed within the cavity in communication with the acoustic port. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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- 2. The microphone of claim 2, comprising an environmental barrier secured to the housing covering the acoustic port.
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3. The microphone of claim 3, the environmental barrier being disposed between layers of the multi-layer wall housing.
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23. A method of manufacturing a microphone comprising:
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providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
disposing a transducer on each of the plurality of bottom layer portions;
securing a second panel comprising a plurality of top layer portions for the plurality of microphones to the first panel, the top layer portion enclosing the transducer within a cavity defined by the top layer portion and the bottom layer portion; and
separating the plurality of microphones. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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Specification