Apparatus and method for calibrating a semiconductor test system

• US 20050024059A1
• Filed: 06/29/2004
• Published: 02/03/2005
• Est. Priority Date: 06/30/2003
• Status: Active Grant

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Infineon Technologies AG
• Inventors: Roth, Arti Prasad, Bucksch, Thorsten
• Granted Patent: US 7,061,227 B2
• Time in Patent Office: Days
• US Class Current: 324/334
• CPC Class Codes: G01R 31/3191 Calibration

Abstract

A process and device for calibrating a semiconductor component test system includes a first connection, at which a corresponding signal, in particular a calibration signal can be input, and a second and third connection, at which the signal, in particular a calibration signal, can be emitted. The first connection is and/or can be connected via a corresponding line to a first switching apparatus, which is and/or can be connected to the second connection. A second switching apparatus is and/or can be connected to the third connection. Advantageously, the signal is then transferred to the second connection, and barred from the third connection by the first switching apparatus being closed and the second switching apparatus being opened.

Claims

1. An apparatus for calibrating a semiconductor component test system, comprising:

a first connection, at which a corresponding calibration signal can be input;

a second connection at which the calibration signal can be emitted; and

a third connection at which the calibration signal can be emitted, wherein

the first connection which is at least one of connected and connectable via a corresponding line to a first switching apparatus, which is at least one of connected and connectable to the second connection, and to a second switching apparatus, which is at least one of connected and connectable to the third connection.

2. An apparatus according to claim 1, wherein, dependent upon a particular calibration procedure to be performed respectively, either the first switching apparatus is closed, and the second switching apparatus is opened so that the calibration signal is transferred to the second connection rather than the third connection or the first switching apparatus is opened and the second switching apparatus is closed so that the calibration signal is transferred to the third connection and not to the second connection.

3. An apparatus according to claim 1, wherein the switching apparatuses are relays.

4. An apparatus according to claim 1, wherein the switching apparatuses are transistors.

5. A system comprising:

a first connection, at which a corresponding calibration signal can be input;

a second connection at which the calibration signal can be emitted;

a third connection at which the calibration signal can be emitted, wherein the first connection which is at least one of connected and connectable via a corresponding line to a first switching apparatus, which is at least one of connected and connectable to the second connection, and to a second switching apparatus, which is at least one of connected and connectable to the third connection; and

a semiconductor component test apparatus which is connected to the first connection.

6. A system according to claim 5, further comprising a calibration apparatus connected to the second connection for calibrating the semiconductor component test apparatus.

7. A system according to claim 5, further comprising at least one of a semiconductor component test card and a probecard connected to the third connection for contacting semiconductor components to be tested by the semiconductor component test apparatus.

8. A system comprising:

a first connection, at which a corresponding calibration signal can be input;

a second connection at which the calibration signal can be emitted;

a third connection at which the calibration signal can be emitted, wherein the first connection which is at least one of connected and connectable via a corresponding line to a first switching apparatus, which is at least one of connected and connectable to the second connection, and to a second switching apparatus, which is at least one of connected and connectable to the third connection; and

a calibration apparatus connected to the first connection for calibrating a semiconductor component test apparatus.

9. A system according to claim 8, wherein the semiconductor component test apparatus is connected to the second connection.

10. A system according to claim 8, further comprising at least one of a semiconductor component test card and a probecard connected to the third connection for contacting the semiconductor components to be tested by the semiconductor component test apparatus.

11. A method for calibrating a semiconductor component test system by using an apparatus, comprising:

inputting a calibration signal at a first connection of the apparatus;

transferring the calibration signal to a second connection of the apparatus; and

blocking the signal from a third connection of the apparatus by closing a first switching apparatus which is at least one of connected and connectable to the first connection, which is at least one of connected and connectable to the second connection, and opening a second switching apparatus which is at least one of connected and connectable to the first connection, which is at least one of connected and connectable to the third connection.