Use of, silyating agents
First Claim
1. A method of passivating a semiconductor substrate comprising a dielectric film to moisture absorption comprising:
- exposing the substrate to a composition comprising at least one silyating agent and at least one substantially non-flammable ether.
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Accused Products
Abstract
The present invention provides improvements to the use of silyating agents in semiconductor processing. More particularly, the silyating agents may be provided in combination with a substantially non-flammable ether, so that the combination is substantially non-flammable. Additionally, the silyating agent may be utilized in vapor form, or applied in conjunction with the electromagnetic radiation. Each of these embodiments can enhance the usability of the silyating agent, i.e., by rendering the silyating agent more safe, more easily utilized in a variety of processing equipment and/or by enhancing the passivation efficacy/efficiency of the silyating agent.
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Citations
24 Claims
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1. A method of passivating a semiconductor substrate comprising a dielectric film to moisture absorption comprising:
exposing the substrate to a composition comprising at least one silyating agent and at least one substantially non-flammable ether. - View Dependent Claims (2, 3, 4)
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5. A method of passivating a semiconductor substrate to moisture absorption comprising:
exposing the substrate to a vapor comprising at least one silyating agent. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A method of passivating a semiconductor substrate comprising a dielectric film having an upper and a lower surface to moisture absorption comprising:
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exposing the substrate to at least one silyating agent; and
exposing the substrate to electromagnetic radiation. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A single processing chamber method for passivating a semiconductor substrate comprising a dielectric film to moisture absorption following a residue removal step comprising:
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placing the substrate within the processing chamber;
exposing at least a portion of the substrate to a residue removal composition;
exposing at least a portion of the substrate to at least one silyating agent. - View Dependent Claims (21, 22, 23, 24)
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Specification