Diffusion solder position, and process for producing it

  • US 20050048758A1
  • Filed: 08/27/2004
  • Published: 03/03/2005
  • Est. Priority Date: 02/28/2002
  • Status: Active Grant
First Claim
Patent Images

1. A diffusion solder position between two parts, the two parts being connected via the diffusion solder position, the diffusion solder position comprising:

  • intermetallic phases formed by at least two solder components, the first of the solder components having a first melting point, the first melting point being less than the melting point of the intermetallic phases, the second of the solder components having a second melting point, the second melting point being higher than the melting point of the intermetallic phases; and

    a diffusion region, the diffusion region having three-dimensionally distributed nanoparticles of a filler material.

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