Light emitting diode carrier

• US 20050052864A1
• Filed: 09/09/2003
• Published: 03/10/2005
• Est. Priority Date: 09/09/2003
• Status: Active Grant

• Current Assignee: Valeo-Sylvania LLC
• Original Assignee: Valeo-Sylvania LLC
• Inventors: Baker, Bradley T., Colip, Matthew S.
• Granted Patent: US 6,964,499 B2
• Time in Patent Office: Days
• US Class Current: 362/236
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/195 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21S 45/47 Passive cooling, e.g. using fins, thermal conductive elements or openings
• CPC Class Codes: F21V 15/02 Cages
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A lamp assembly (10) has a carrier (12) with a front side (14) and a backside (16) provided with a plurality of passages (18) therethrough. A circuit board (20) includes a first surface (22) and a second surface (24). A plurality of light sources (26) is mounted on the first surface (22), and the first surface (22) of the circuit board (20) is aligned with the backside (16) of the carrier (12). The plurality of light sources (26) is aligned with the plurality of passages (18) in one-to-one relationship. At least one heat sink (28) is mounted in thermal contact with at least one of the plurality of light sources.

Claims

1. A lamp assembly comprising:

a carrier having a front side and a backside provided with a plurality of passages therethrough;

a circuit board including a first surface and a second surface; and

a plurality of light sources mounted on said first surface, said first surface of said circuit board being aligned with said backside of said carrier, said plurality of light sources being aligned with said plurality of said passages in one-to-one relationship.

2. The lamp assembly of claim 1 wherein at least one heat sink is mounted in thermal contact with at least one of said plurality of light sources.

3. The lamp assembly of claim 1 wherein said heat sink is mounted to the second surface of said circuit board.

4. The lamp assembly of claim 1 wherein said heat sink is mounted to said carrier.

5. The lamp assembly of claim 1 wherein said carrier and said circuit include mating step portions extending in separate planes.

6. The lamp assembly of claim 4 wherein said carrier and said circuit board are substantially annular.

7. The lamp assembly of claims 1, wherein said light source are light emitting diodes.

8. The lamp assembly of claim 6 wherein a light-transmissive optical assembly is operatively positioned with respect to said light sources.