Display device and method of fabricating the same

• US 20050070038A1
• Filed: 10/21/2004
• Published: 03/31/2005
• Est. Priority Date: 03/10/1995
• Status: Abandoned Application

• Current Assignee: Setsuo Nakajima, Shunpei Yamazaki, Yasuhiko Takemura, Yasuyuki Arai
• Original Assignee: Setsuo Nakajima, Shunpei Yamazaki, Yasuhiko Takemura, Yasuyuki Arai
• Inventors: Nakajima, Setsuo, Arai, Yasuyuki, Takemura, Yasuhiko, Yamazaki, Shunpei
• Application Number:
  US10/968,953
• Publication Number:
  US 20050070038A1
• Time in Patent Office: Days
• US Class Current: 438/30
• CPC Class Codes: G02F 1/1303 Apparatus specially adapted to the manufacture of LCDs
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.

Claims

1. (canceled)

2. A method of manufacturing a display device comprising:

forming a color filter over a first substrate;

forming a planarization film over the color filter;

forming an electrode over the planarization film;

forming an orientation film over the electrode;

providing a driver circuit over the first substrate with an adhesive therebetween, said driver circuit held by a second substrate;

removing said second substrate providing said driver circuit over the first substrate;

forming a sealing material over the first substrate;

dripping a liquid crystal material onto the orientation film;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and second substrates.

3. The method according to claim 2 wherein said display device is a passive type display device.

4. The method according to claim 2 wherein said display device is an active matrix display device.

5. A method of manufacturing an active matrix display device comprising:

forming an electrode over a first substrate;

forming an orientation film over the electrode;

forming a sealing material over first substrate;

dripping a liquid crystal material onto the orientation film;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and second substrates.

6. The method according to claim 5 wherein said electrode is formed by printing.

7. The method according to claim 5 wherein said orientation film is formed by printing.

8. The method according to claim 5 wherein the sealing material is cured by heating.

9. The method according to claim 5 wherein said sealing material is formed by printing.

10. A method of manufacturing an active matrix display device comprising:

forming an electrode over a first substrate;

forming spacers over the electrode;

forming a sealing material over first substrate;

dripping a liquid crystal material onto the first substrate;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and second substrates.

11. The method according to claim 10 wherein said electrode is formed by printing.

12. The method according to claim 10 wherein said spacers are formed by spraying.

13. The method according to claim 10 wherein the sealing material is cured by heating.

14. The method according to claim 10 wherein said sealing material is formed by printing.

15. The method according to claim 10 further comprising an orientation film over the first substrate.

16. A method of manufacturing a display device comprising:

forming a color filter over a first substrate;

forming a planarization film over the color filter;

forming an electrode over the planarization film;

forming a sealing material over the first substrate;

dripping a liquid crystal material over the first substrate;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and second substrates.

17. The method according to claim 16 wherein said color filter is formed by printing.

18. The method according to claim 16 wherein said planarization film is formed by printing.

19. The method according to claim 16 wherein said electrode is formed by printing.

20. The method according to claim 16 wherein said sealing material is cured by heating.

21. A method of manufacturing a display device comprising:

forming a color filter over a first substrate;

forming a planarization film over the color filter;

forming an electrode over the planarization film;

forming an orientation film over the electrode;

forming a sealing material over the first substrate;

dripping a liquid crystal material over the first substrate;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and second substrates.

22. The method according to claim 21 wherein said orientation film is formed by printing.

23. The method according to claim 21 wherein said planarization film is formed by printing.

24. The method according to claim 21 wherein said electrode is formed by printing.

25. The method according to claim 21 wherein said orientation film is formed by printing.

26. The method according to claim 21 wherein said sealing material is cured by heating.

27. A method of manufacturing a display device comprising:

forming a color filter over a first substrate;

forming a planarization film over the color filter;

forming an electrode over the planarization film;

forming spacers the first substrate;

forming a sealing material over the first substrate;

dripping a liquid crystal material over the first substrate;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and second substrates.

28. The method according to claim 27 wherein said color filter is formed by printing.

29. The method according to claim 27 wherein said planarization film is formed by printing.

30. The method according to claim 27 wherein said electrode is formed by printing.

31. The method according to claim 27 wherein said spacers are formed by spraying.

32. The method according to claim 27 wherein said sealing material is cured by heating.

33. A method of manufacturing an active matrix display device comprising:

forming an electrode over a first substrate;

forming an orientation film over the electrode;

providing a driver circuit over the first substrate with an adhesive therebetween, said driver circuit held by a second substrate;

forming a sealing material over the first substrate;

dripping a liquid crystal material onto the orientation film;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and second substrates.

34. The method according to claim 33 further comprising a step of removing said second substrate after providing said driver circuit over the first substrate.