Light-emitting diode and method of manufacturing the light-emitting diode

• US 20050077534A1
• Filed: 10/09/2003
• Published: 04/14/2005
• Est. Priority Date: 10/09/2003
• Status: Abandoned Application

• Current Assignee: Opto-Device Co., Ltd., Tabuchi Electric Company Limited
• Original Assignee: Opto-Device Co., Ltd., Tabuchi Electric Company Limited
• Inventors: Yang, Bing Lin, Koshihara, Masahiko
• Application Number:
  US10/681,114
• Publication Number:
  US 20050077534A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light-emitting diode has a case having a concave portion, a reflection mirror obtained by forming metal on the concave portion, and a lead to one end of which a light-emitting element is attached. A cavity including the concave portion of the case is filled with an accelerated curing epoxy resin. The epoxy resin is cured so that the epoxy resin, the reflection mirror and the case are formed into a sandwich structure. With such a structure, a light-emitting diode free of wrinkles and cracks on the reflection mirror is provided. Further, at the time of handling or transportation, the reflection mirror is not damaged. Moreover, during reflow soldering, at the time of solder-mounting the light-emitting diode to a printed circuit board, thermal deformation, such as wrinkling and cracking of the reflection mirror is completely prevented.

Claims

1. A light-emitting diode comprising:

a case having a concave inner surface;

a metal reflection mirror on the concave inner surface; and

a lead to one end of which a light-emitting element is attached, wherein a cavity of the concave inner surface of the case is filled with an accelerated curing epoxy resin, and the reflection mirror is sandwiched between the case and said accelerated curing epoxy resin to form a sandwich structure.

2. The light-emitting diode according to claim 1, wherein the lead is fitted into a groove in an upper end face of the case and the case is filled with the accelerated curing epoxy resin up to the upper end face of the case.

3. The light-emitting diode according to claim 1, wherein the accelerated curing epoxy resin is a novolak.

4. The light-emitting diode according to claim 1, wherein the case is made of a heat-resistant resin selected from the group consisting of a polycarbonate resin, a PPS alloy resin, and a polyether ether ketone resin.

5. The light-emitting diode according to claim 4, wherein the heat-resistant resin contains glass fibers.

6. The light-emitting diode according to claim 5, wherein a base layer of the heat-resistant epoxy resin is formed on the surface of the concave inner surface, the metal reflection mirror is formed on the base layer.

7. The light-emitting diode according to claim 1, further comprising a frame on the upper end face of the case, wherein the frame has a protrusion filling a gap between an upper surface of the lead fitted into the groove and the frame.

8. A light-emitting diode manufacturing method including forming a case having a concave inner surface forming a reflection mirror by forming a metal on the concave inner surface, and forming a lead to one end of which a light-emitting element is attached, comprising steps of:

filling a cavity including the concave inner surface of the case with an accelerated curing epoxy resin; and

curing the epoxy resin to sandwich the reflection mirror between the accelerated curing epoxy resin and the case to form a sandwich structure.

9. The light-emitting diode manufacturing method according to claim 8, wherein the step of filling the cavity with the accelerated curing epoxy resin includes:

fitting the lead into a groove on a upper end face of the case; and

filling the case with the accelerated curing epoxy resin up to the upper end face of the case.

10. The light-emitting diode manufacturing method according to claim 8, wherein a novolak is used as the accelerated curing epoxy resin.

11. The light-emitting diode manufacturing method according to claim 8, wherein, in forming said case having the concave inner surface, a heat-resistant resin selected from the group consisting of a polycarbonate resin, a PPS alloy resin, and a polyether ether ketone resin is used as the material of the case.

12. The light-emitting diode manufacturing method according to claim 11, wherein the heat-resistant resin contains glass fibers.

13. The light-emitting diode manufacturing method according to claim 12, further includes steps of:

forming a base layer of the heat-resistant epoxy resin on the surface of the concave inner surface, and

forming the metal reflection mirror on the base layer.

14. The light-emitting diode manufacturing method according to claim 8, wherein the step of filling the cavity includes:

fitting the lead into a groove provided on an upper end face of the case;

putting a frame covering the upper end face of the case, and having a protrusion on a portion corresponding to the groove, on the case; and

filling the case with the accelerated curing epoxy resin up to the upper end face.