Semiconductor radiation emitter package
First Claim
1. A semiconductor radiation emitter package comprising:
- a heat extraction element;
at least two electrical leads having a greater thermal resistance than said heat extraction element;
at least one semiconductor radiation emitter mounted on a first surface of said heat extraction element, wherein when said at least one semiconductor radiation emitter is activated, the semiconductor radiation emitter package emits white light; and
an encapsulant covering said at least one semiconductor radiation emitter, at least a portion of said encapsulant being substantially transparent to wavelengths emitted by said at least one semiconductor radiation emitter, said encapsulant material covering a portion of the first surface of said heat extraction element, while leaving exposed at least a portion of a second surface of said heat extraction element that is opposite the first surface, the exposed portion of the second surface being directly opposite an area of the first surface where said at least one semiconductor radiation emitter is mounted.
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Accused Products
Abstract
A semiconductor optical radiation package includes a leadframe, at least one semiconductor optical radiation emitter, and an encapsulant. The leadframe has a heat extraction member, which supports the semiconductor optical emitter and provides one or more thermal paths for removing heat generated within the emitter to the ambient environment, as well as at least two electrical leads for providing electrical coupling to the semiconductor optical radiation emitter. The encapsulant covers and protects the emitter and optional wire bonds from damage and allows radiation to be emitted from the emitter into the ambient environment. The semiconductor optical radiation package provides high emitted flux and is preferably compatible with automated processing techniques.
123 Citations
156 Claims
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1. A semiconductor radiation emitter package comprising:
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a heat extraction element;
at least two electrical leads having a greater thermal resistance than said heat extraction element;
at least one semiconductor radiation emitter mounted on a first surface of said heat extraction element, wherein when said at least one semiconductor radiation emitter is activated, the semiconductor radiation emitter package emits white light; and
an encapsulant covering said at least one semiconductor radiation emitter, at least a portion of said encapsulant being substantially transparent to wavelengths emitted by said at least one semiconductor radiation emitter, said encapsulant material covering a portion of the first surface of said heat extraction element, while leaving exposed at least a portion of a second surface of said heat extraction element that is opposite the first surface, the exposed portion of the second surface being directly opposite an area of the first surface where said at least one semiconductor radiation emitter is mounted. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56)
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57. A semiconductor radiation emitter package comprising:
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a heat extraction element;
at least two electrical leads having a greater thermal resistance than said heat extraction element;
at least one semiconductor radiation emitter mounted on a first surface of said heat extraction element, wherein when said at least one semiconductor radiation emitter is activated, the semiconductor radiation emitter package emits white light; and
a first hard molding compound and a second hard molding compound, said first hard molding compound is substantially transparent to radiation emitted by said at least one semiconductor radiation emitter and is provided within the optical path of radiation emitted from said at least one semiconductor radiation emitter, wherein said second hard molding compound covers a portion of the first surface of said heat extraction element, while leaving exposed at least a portion of a second surface of said heat extraction element that is opposite the first surface, the exposed portion of the second surface being directly opposite an area of the first surface where said at least one semiconductor radiation emitter is mounted. - View Dependent Claims (58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72)
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73. A semiconductor radiation emitter package comprising:
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a heat extraction element;
at least two electrical leads having a greater thermal resistance than said heat extraction element, said heat extraction element having a thickness in a direction that is substantially parallel to the direction in which radiation is emitted from the semiconductor radiation emitter package that is greater than the thickness of said electrical leads;
at least one semiconductor radiation emitter mounted on said heat extraction element, wherein when said at least one semiconductor radiation emitter is activated, the semiconductor radiation emitter package emits white light; and
a first hard molding compound covering said at least one semiconductor radiation emitter, at least a portion of said first hard molding compound being substantially transparent to wavelengths emitted by said at least one semiconductor radiation emitter. - View Dependent Claims (74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89)
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90. A semiconductor radiation emitter package comprising:
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a heat extraction element;
at least two electrical leads having a greater thermal resistance than said heat extraction element;
at least one semiconductor radiation emitter mounted on a first surface of said heat extraction element; and
an encapsulant encapsulating said at least one semiconductor radiation emitter, a portion of said heat extraction element and a portion of said electrical leads, wherein a cross-sectional area of said heat extraction element measured in a plane normal to the path between said at least one semiconductor radiation emitter and the nearest unencapsulated surface of said heat extraction element is greater than a cross-sectional area of each of said electrical leads measured in a plane that is normal to the path of heat flow between said at least one semiconductor radiation emitter and the nearest unencapsulated surface of said electrical leads during operation of the package, wherein said encapsulant defines a plurality of sides and said heat extraction element extends out through two of said sides. - View Dependent Claims (91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 119, 120, 121, 122)
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123. A semiconductor radiation emitter package comprising:
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a heat extraction element;
at least two electrical leads having a greater thermal resistance than said heat extraction element;
at least one semiconductor radiation emitter mounted on a first surface of said heat extraction element, wherein when said at least one semiconductor emitter is activated, the semiconductor radiation emitter package emits white light;
a first hard molding compound substantially transparent to radiation emitted by said at least one semiconductor radiation emitter, said first hard molding compound is provided within the optical path of radiation emitted from said at least one semiconductor radiation emitter; and
a second hard molding compound covering a portion of said heat extraction element, while leaving exposed a portion of said heat extraction element, said second hard molding compound being different from said first hard molding compound and encapsulating a portion of said electrical leads so as to retain said electrical leads. - View Dependent Claims (124, 125, 126, 127, 128, 129, 130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141, 142, 143, 144)
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145. An LED package comprising:
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a heat extraction element having a first surface and a second surface that is opposite the first surface;
a first electrical lead and a second electrical lead;
an LED chip mounted to the first surface of said heat extraction element for emitting light generally along an optical path, wherein said LED chip is energized via said first and second electrical leads, when said LED chip is energized, the LED package is capable of emitting white light; and
an encapsulant covering a portion of said first and second electrical leads, said LED chip, and a portion of said heat extraction element, said encapsulant is formed to leave exposed at least a portion of the second surface of said heat extraction member, the exposed portion of said heat extraction member including a region generally directly opposite a location on the first surface where said LED chip is mounted, wherein said encapsulant comprises two different materials including a first hard molding compound and a second hard molding compound, said first hard molding compound is substantially transparent to light emitted by said LED chip and is provided within the optical path of light emitted from said LED chip and is shaped to define a lens, wherein said second hard molding compound is provided where said encapsulant covers said electrical leads and in regions generally not within the optical path of light emitted from said LED chip, said second hard molding compound is substantially opaque, wherein a cross-sectional area of said heat extraction element measured in a plane normal to the path between said LED chip and the nearest exposed surface of said heat extraction element is greater than a cross-sectional area of each of said electrical leads measured in a plane that is normal to the path of heat flow between said LED chip and the nearest exposed surface of said electrical leads, during operation of the package, wherein said encapsulant forms a plurality of sides, said first and second electrical leads extend through one of a first set of encapsulant sides, said heat extraction member extends through at least one of a second set of encapsulant sides including at least two sides, the second set of encapsulant sides different from the first set of encapsulant sides, and wherein said heat extraction element having a thickness in a direction that is substantially parallel to the direction in which light is emitted from the LED package that is greater than the thickness of said electrical leads. - View Dependent Claims (146, 147, 148, 149, 150, 151, 152, 153, 154, 155, 156)
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Specification