Automotive control module housing

• US 20050088826A1
• Filed: 11/17/2004
• Published: 04/28/2005
• Est. Priority Date: 07/22/2002
• Status: Active Grant

• Current Assignee: Vitesco Technologies USA, LLC (Continental AG)
• Original Assignee: Siemens VDO Automotive Corporation (Siemens AG)
• Inventors: Throum, Michael
• Granted Patent: US 7,050,305 B2
• Time in Patent Office: Days
• US Class Current: 361/719
• CPC Class Codes: H05K 5/0013 assembled by resilient members
• CPC Class Codes: H05K 5/0052 characterized by joining features of the housing parts

Abstract

An automotive control module includes a plastic housing with a snap-fit metal cover. A printed circuit board is positioned within a cavity formed in the housing, and is attached to the housing with a plurality of fasteners. Resilient tabs are formed on side walls of the housing and grip a cover plate surface to define a snap-fit attachment. Once the cover is attached to the plastic housing, the printed circuit board is enclosed within the cavity between the cover and the housing. The cover includes a plurality of heat transfer fins and/or stamped indentations that form surfaces that are positioned in close proximity to the printed circuit board. The cover utilizes these fins and surfaces to form a heat sink for cooling electronics mounted to the printed circuit board.

Claims

1. An automotive electronic control module assembly comprising:

a housing defining an inner cavity;

a printed circuit board positioned within said cavity and mounted to said housing;

a cover plate positioned over said cavity to enclose said printed circuit board within said housing;

a plurality of resilient members formed on said housing; and

a retaining surface formed on said cover plate wherein said resilient members engage said retaining surface to securely attach said cover plate to said housing.

2. An assembly as set forth in claim 1 wherein said cover plate is positioned in an overlapping non-contact relationship with said printed circuit board and is spaced apart from said printed circuit board by a gap to form a heat sink.

3. An assembly as set forth in claim 2 wherein said cover plate is comprised of a generally flat sheet portion having an upper surface and a lower surface and includes at least one stamped indentation defining an indentation bottom surface that is non-coplanar with said upper and lower surfaces of said flat sheet portion.

4. An assembly as set forth in claim 3 wherein said gap has a predefined minimum gap height of approximately 0.3 millimeters between said indentation bottom surface and said printed circuit board.

5. An assembly as set forth in claim 2 wherein said housing is comprised of a plastic material and said cover plate is comprised of a metallic material.

6. An assembly as set forth in claim 2 wherein said cover plate is comprised of a base portion with a plurality of fins extending outwardly from said base portion and away from said printed circuit board.

25. An assembly as set forth in claim 5 wherein said metallic material comprises aluminum.

26. An assembly as set forth in claim 1 wherein said cover plate includes an upper portion and an indentation portion forming a heat sink wherein said indentation portion is spaced apart from said printed circuit board to form a gap.

27. An assembly as set forth in claim 26 wherein said upper portion includes a generally flat upper surface and said indentation portion includes a generally flat indentation surface that is non-coplanar to said upper surface.

28. An assembly as set forth in claim 1 wherein said resilient members each comprise a resilient tab having a transversely extending distal tip facing inwardly toward a center of said inner cavity.

29. An assembly as set forth in claim 1 wherein said housing includes a pair of outer side walls and a pair of inner side walls spaced apart from and generally parallel to said outer side walls, said resilient members being formed on at least one of said outer side walls.

30. An assembly as set forth in claim 29 wherein said cover plate includes an upper surface and a lower surface and wherein said resilient members engage said upper surface and said inner side walls engage said lower surface.

31. An assembly as set forth in claim 29 wherein a maximum dimension of said cover plate is less than a distance defined between said pair of outer side walls.

7-12. -12. (canceled)

13. An automotive electronic control module assembly comprising:

a plastic housing including a bottom portion, a first pair of opposing outer side walls extending upwardly from said bottom portion, a second pair of opposing outer side walls extending between both of said first pair of opposing outer side walls and cooperating with said bottom portion to define a cavity, and a pair of opposing inner side walls positioned within said cavity in an orientation parallel to and spaced apart from said first pair of opposing outer side walls;

a printed circuit board positioned within said cavity between said inner side walls;

a cover positioned over said cavity to enclose said printed circuit board within said housing, said cover having a body portion and including at least one heat transfer member that is positioned closer to said printed circuit board than said body portion to form a heat sink to facilitate heat transfer from said printed circuit board to said cover;

a plurality of resilient members formed on said housing; and

a retaining surface formed on said cover wherein said resilient members engage said retaining surface to securely attach said cover to said housing.

17. An assembly as set forth in claim 13 wherein said cover is comprised of a plate having an upper surface and a lower surface and wherein said heat transfer member comprises an indentation defining an indentation bottom surface that is non-coplanar with said upper and lower surfaces of said plate.

32. An assembly as set forth in claim 17 wherein said indentation is spaced apart from said printed circuit board to define a gap.

33. An assembly as set forth in claim 13 wherein said cover includes an upper surface and a lower surface and wherein said resilient members engage said upper surface and said inner side walls engage said lower surface.

14-16. -16. (canceled)

18-19. -19. (canceled)

20. A method for assembling an automotive electronic control module comprising the steps of:

a) mounting a printed circuit board within a cavity formed within a plastic housing; and

b) enclosing the printed circuit board within the cavity by snapping a cover plate into gripping engagement with the housing to form a secure snap-fit attachment between the housing and the cover plate.

21. A method set forth in claim 20 including unsnapping the cover plate from the housing when necessary to perform service operations.

22. A method set forth in claim 21 wherein step (b) further includes forming the cover plate from aluminum to include a body portion with at least one indentation, and positioning the indentation closer to the printed circuit board than the body portion to form a heat sink that facilitates heat transfer from the printed circuit board to the cover plate.

24. A method as set forth in claim 21 wherein step (b) further includes forming a plurality of fins on an upper surface of the cover plate with the fins extending outwardly from the upper surface and away from the printed circuit board to facilitate heat transfer from the printed circuit board to the cover plate.

34. A method as set forth in claim 22 including spacing the indentation apart from the printed circuit board to form a gap.

35. A method as set forth in claim 20 forming the housing with a pair of outer side walls and a pair of inner side walls spaced apart and generally parallel to the outer side walls, forming resilient members on the outer side walls, and gripping an upper surface of the cover plate with the resilient members.

23. (canceled)