Method and system for non-vascular sensor implantation

• US 20050090866A1
• Filed: 11/22/2004
• Published: 04/28/2005
• Est. Priority Date: 10/23/2001
• Status: Active Grant

• Current Assignee: Medtronic Minimed Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Minimed Incorporated (Medtronic Plc)
• Inventors: Shah, Rajiv, Miller, Michael E.
• Granted Patent: US 8,465,466 B2
• Time in Patent Office: Days
• US Class Current: 607/2
• CPC Class Codes: A61B 17/3468 for implanting or removing devices, e.g. prostheses, implants, seeds, wires devices for implanting seeds A61M37/0069
• CPC Class Codes: A61B 5/0006 ECG or EEG signals
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/145 Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissuemeasuring of blood pressure or blood flow A61B5/02; non-radiation detecting or locating of foreign bodies in blood A61B5/06
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/6882 Anchoring means
• CPC Class Codes: A61M 1/1698 Blood oxygenators with or without heat-exchangers intracorporal A61M1/1678; manufacturing of membranes therefor B01D67/00; semi-permeable membranes for separation processes characterised by their properties B01D69/00; semi-permeable membranes characterised by their material B01D71/00
• CPC Class Codes: A61M 2230/20 Blood composition characteristics
• CPC Class Codes: A61M 2230/201 Glucose concentration
• CPC Class Codes: A61M 5/14276 specially adapted for implantation
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 2203/085 Using vacuum or low pressure
• CPC Class Codes: H05K 2203/1147 Sealing or impregnating, e.g. of pores
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 2203/308 Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates

Abstract

A method and system for non-vascular sensor implantation. An implant unit is implanted in an area of a body and a foreign body capsule is allowed to form around the area of the implant unit. The sensor may be directed into a body cavity such as, for example, the peritoneal space, subcutaneous tissues, the foreign body capsule, or other area of the body. A subcutaneous area of the body may be tunneled to place the sensor. The system may include an implant unit such as, for example, for delivering drug to a human body and a sensor for detecting a physiological parameter. The sensor may be separate from and connectable to the implant unit and may be placed in a non-vascular area of the human body.

Claims

1. A method for non-vascular implant of a sensor comprising:

implanting an implant unit in an area of a body without passing the implant unit through a vascular system;

allowing a foreign body capsule to form around the area of the implant unit;

directing the sensor into the foreign body capsule; and

connecting the sensor to the implant unit subsequent to formation of the foreign body capsule.

2. The method of claim 1, wherein implanting an implant unit comprises incising an area of the body large enough for the implant unit.

3. The method of claim 1, further comprising placing a material around the implant unit for promoting growth characteristics.

4. The method of claim 1, wherein the implant unit comprises electronics.

5. The method of claim 1, wherein the implant unit comprises a pump.

6. The method of claim 1, wherein allowing a foreign body capsule to form comprises inserting materials around the implant unit to promote growth characteristics.

7. The method of claim 1, further comprising attaching the sensor to the implant unit.

8. The method of claim 7, wherein the sensor is attached to the implant unit prior to formation of the foreign body capsule.

9. The method of claim 7, wherein the sensor is attached to the implant unit subsequent to formation of the foreign body capsule.

10. The method of claim 1, further comprising incising an area of the body large enough for the sensor.

11. The method of claim 10, wherein the incised area of the body large enough for the sensor is smaller than an incised area of the body large enough for the implant unit.

12-32. -32. (canceled)

33. A method for non-vascular implant of a sensor comprising:

implanting an implant unit in a body cavity;

allowing a foreign body capsule to form around the implant unit;

directing the sensor into the foreign body capsule; and

connecting the sensor to the implant unit subsequent to formation of the foreign body capsule.