Thermally conductive electronic connector having molded housing

• US 20050095901A1
• Filed: 12/14/2004
• Published: 05/05/2005
• Est. Priority Date: 08/04/2000
• Status: Active Grant

• Current Assignee: Ticona Polymers, Inc. (Celanese Corporation)
• Original Assignee: Cool Options, Inc.
• Inventors: Sagal, E. Mikhail, McCullough, Kevin A., Miller, James D.
• Granted Patent: US 6,981,805 B2
• Time in Patent Office: Days
• US Class Current: 439/485
• CPC Class Codes: G02B 6/3814 with cooling or heat dissipation means
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4272 with mounting substrates of high thermal conductivity
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/4284 of optical modules with disconnectable electrical connectors latching arms for electrical connectors H01R13/627
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating
• CPC Class Codes: H05K 9/0083 comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers H05K9/0086 takes precedence

Abstract

An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

Claims

1. An electronic connector, comprising:

a housing having a surface portion for receiving a circuit board; and

a circuit board mounted on the surface portion, the circuit board including a heat-generating component residing thereon, wherein the housing is molded over the circuit board and heat-generating component and the housing is made of a thermally-conductive polymer composition, the composition including a base polymer and thermally-conductive filler material.

2. The electronic connector of claim 1, wherein the base polymer is a liquid crystal polymer.

3. The electronic connector of claim 1, wherein the base polymer is polycarbonate.

7. The electronic connector of claim 1, wherein the base polymer is a liquid crystal polymer and the thermally conductive filler material is boron nitride particles having an aspect ratio of 5:

1 or less.

8. The electronic connector of claim 1, wherein the base polymer is a liquid crystal polymer and the thermally conductive filler material is carbon fiber having an aspect ratio of at least 10:

1.

4. The electronic connector of claim l, wherein the thermally-conductive filler material is selected from the group consisting of boron nitride, aluminum, alumina, copper, magnesium, brass, nickel, boron nitride, and carbon materials.

5. The electronic connector of claim 4, wherein the thermally-conductive filler material is in the form of particles.

6. The electronic connector of claim 4, wherein the thermally-conductive filler material is in the form of fibers.

9. An electronic connector, comprising:

a housing having a surface portion for receiving a circuit board; and

a circuit board mounted on the surface portion, the circuit board including a heat-generating component residing thereon, wherein the housing is molded over the heat-generating component and circuit board and the housing is made of a thermally-conductive polymer composition, the composition including i) 30% to 60% by volume of a base polymer, ii) 25% to 50% by volume of a first thermally-conductive filler material having an aspect ratio of at least 10;

1, and iii) 10% to 25% by volume of a second thermally-conductive filler material having an aspect ratio of 5;

1 or less.

10. The electronic connector of claim 9, wherein the base polymer is a liquid crystal polymer.

11. The electronic connector of claim 9, wherein the base polymer is polycarbonate.

12. The electronic connector of claim 9, wherein the first thermally-conductive filler material is selected from the group consisting of aluminum, alumina, copper, magnesium, brass, nickel, boron nitride, and carbon materials.

13. The electronic connector of claim 9, wherein the second thermally-conductive filler material is selected from the group consisting of aluminum, alumina, copper, magnesium, brass, nickel, boron nitride, and carbon materials.

14. The electronic connector of claim 9, wherein the base polymer is a liquid crystal polymer, the first thermally conductive filler material is carbon fiber, and the second thermally conductive filler material is boron nitride particles.

15. The electronic connector of claim 9, wherein the base polymer is polycarbonate, the first thermally conductive filler material is carbon fiber, and the second thermally conductive filler material is boron nitride particles.

16. A method of making an electronic connector having a molded housing, comprising the steps of:

providing a circuit board including a heat-generating component residing thereon,

molding a thermally-conductive polymer composition over the heat-generating component and circuit board to form a molded housing, the composition including a base polymer and thermally-conductive filler material.

17. The method of claim 16, wherein the base polymer is a liquid crystal polymer.

18. The method of claim 16, wherein the base polymer is polycarbonate.

19. The method of claim 16, wherein the thermally-conductive filler material is selected from the group consisting of boron nitride, aluminum, alumina, copper, magnesium, brass, nickel, boron nitride, and carbon materials.

20. A method of making an electronic connector having a molded housing, comprising the steps of:

providing a circuit board including a heat-generating component residing thereon,

molding a thermally conductive polymer composition over the heat-generating component and circuit board to form a molded housing, the composition including;

i) 30% to 60% by volume of a base polymer, ii) 25% to 50% by volume of a first thermally conductive filler material having an aspect ratio of at least 10;

1, and iii) 10% to 25% by volume of a second thermally conductive filler material having an aspect ratio of 5;

1 or less.

21. The method of claim 20, wherein the base polymer is a liquid crystal polymer, the first thermally conductive filler material is carbon fiber, and the second thermally conductive filler material is boron nitride particles.

22. The method of claim 20, wherein the base polymer is polycarbonate, the first thermally conductive filler material is carbon fiber, and the second thermally conductive filler material is boron nitride particles.