Systems for regulating the temperature of a heating or cooling device using non-electric controllers and non-electric controllers therefor

• US 20050103041A1
• Filed: 05/21/2004
• Published: 05/19/2005
• Est. Priority Date: 11/14/2003
• Status: Active Grant

• Current Assignee: Aqueduct Medical, Inc.
• Original Assignee: Aqueduct Medical, Inc.
• Inventors: Krempel, Benjamin J.
• Granted Patent: US 7,347,060 B2
• Time in Patent Office: Days
• US Class Current: 62/383
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/025 Removal of heat
• CPC Class Codes: F25D 19/006 Thermal coupling structure or interface
• CPC Class Codes: F25D 2600/04 Controlling heat transfer
• CPC Class Codes: G05D 23/08 with bimetallic element

Abstract

Described here are systems for regulating the temperature of a heating or cooling device without adjusting the input power. In general, the systems described here comprise a heating or cooling device and a controller. The heating or cooling device typically comprises a cold region and a hot region, there being a temperature difference between the two, and an input power. The controllers are configured to be placed in thermal contact with at least a portion of the cold region and at least a portion of the hot region, and are configured to create a path for heat exchange between the portions of the contacted hot and cold regions. The heat exchanged may be controlled and the temperature of the system may be user adjustable, or it may be automatically controlled.

Claims

1. :

A system for regulating the temperature of a heating or cooling device without adjusting the input power, comprising;

a heating or cooling device comprising a cold region, a hot region, and an input power, there being a temperature difference between the cold region and the hot region; and

a controller comprising a heat transfer pathway in thermal contact with at least a portion of the cold region and at least a portion of the hot region, the heat transfer pathway configured to create a path for heat exchange between the portion of contacted hot region and the portion of contacted cold region, whereby the heat transfer pathway is controlled to regulate the temperature of one of the regions, resulting in a controlled region and a non-controlled region.

2. :

The system of claim 1 wherein the heat transfer pathway comprises a thermally conductive solid.

3. :

The system of claim 2 wherein the thermally conductive solid is a metal selected from the group consisting of aluminum, copper, silver and gold.

4. :

The system of claim 2 wherein the thermally conductive solid has a thermal conductivity of at least 50 (W)(m<sup>−

1</sup>)(°

C.<sup>−

1</sup>).

5. :

The system of claim 1 wherein the heat transfer pathway comprises a fluid circuit, said fluid circuit comprising a channel with a fluid therethrough.

6. :

The system of claim 5 further comprising an adjustable valve for controlling the path of the fluid in the fluid circuit.

7. :

The system of claim 6 where the adjustable valve is electrically actuated.

8. :

The system of claim 7 where the adjustable valve comprises a thermistor.

9. :

The system of claim 7 where the adjustable valve is actuated with a solenoid.

10. :

The system of claim 1 wherein the input power to the heating or cooling device is constant.

11. :

The system of claim 1 wherein the heat transfer pathway comprises a gas circuit, said gas circuit configured to allow gas to flow therethrough.

12. :

The system of claim 11 further comprising an adjustable valve for controlling the path of the gas in the gas circuit.

13. :

The system of claim 1 further comprising a thermostatic valve, wherein the thermostatic valve is configured to regulate the temperature of the controlled region.

14. :

The system of claim 13 wherein the heat exchange between the non-controlled region and the controlled region is regulated, at least in part, by thermal expansion of the thermostatic valve.

15. :

The system of claim 13 wherein the thermostatic valve is thermally insulated from the non-controlled region.

16. :

The system of claim 13 wherein the heat transfer pathway is modified, at least in part, by thermal expansion of the thermostatic valve.

17. :

The system of claim 13 wherein the thermostatic valve is configured to be in thermal contact with at least a portion of the controlled region.

18. :

The system of claim 13 wherein the thermostatic valve comprises a wax.

19. :

The system of claim 13 wherein the thermostatic valve comprises a bimetal.

20. :

The system of claim 13 wherein the thermostatic valve comprises a liquid filled actuator.

21. :

The system of claim 13 wherein the thermostatic valve comprises a spring or coil.

22. :

The system of claim 13 wherein the temperature of the controlled region is automatically controlled.

23. :

The system of claim 1 wherein the temperature of the controlled region is user adjustable.

24. :

The system of claim 1 wherein the heating or cooling device comprising a thermoelectric module.

25. :

A system for regulating the temperature of a heating or cooling device without adjusting the input power, comprising;

a heating or cooling device comprising a cold region, a hot region, and an input power, there being a temperature difference between the cold region and the hot region; and

a controller comprising a fluid circuit in thermal contact with at least a portion of the cold region and at least a portion of the hot region, the fluid circuit configured to create a path for heat exchange between the portion of contacted hot region and the portion of contacted cold region, and a thermostatic valve configured to regulate the heat exchange between the cold region and the hot region, resulting in a controlled region and a non-controlled region.

26. :

A controller for regulating the temperature of a heating or cooling device comprising;

a heat transfer pathway, the heat transfer pathway configured to be placed in thermal contact with at least a portion of the cold region of a heating or cooling device and at least a portion of the hot region of a heating or cooling device, the heat transfer pathway further configured to create a path for heat exchange between the portion of contacted hot region and the portion of contacted cold region, whereby the heat transfer pathway is controlled to regulated the temperature of one of the regions, resulting in a controlled region and a non-controlled region.

27. :

A method of controlling the temperature of a heating or cooling device without adjusting the input power, comprising;

providing a heating or cooling device comprising a cold region, a hot region, and an input power;

providing a heat transfer pathway in thermal contact with at least a portion of the cold region and at least a portion of the hot region, the heat transfer pathway configured to create a path for heat exchange between the portion of contacted hot region and the portion of contacted cold region;

regulating the heat transfer pathway to control the heat exchanged between the regions, so that the temperature of one of the regions is controlled.

28. :

A method of controlling the temperature of a heating or cooling device without adjusting the input power, comprising;

providing a heating or cooling device comprising a cold region, a hot region, and an input power;

providing a fluid circuit comprising a channel with fluid therethrough, said fluid circuit in thermal contact with at least a portion of the cold region and at least a portion of the hot region, the fluid circuit configured to create a path for heat exchange between the portion of contacted hot region and the portion of contacted cold region;

providing a thermostatic valve for modifying the path and flow rate of the fluid in at least a region of the fluid circuit;

regulating the fluid circuit with at least the thermostatic valve to control the heat exchanged between the cold region and the hot region, so that the temperature of one of the regions is controlled.